Samsung develops 12-layer TSV package

Samsung has developed 12-Layer 3D-TSV TSV chip packaging technology. The technology allows the stacking of 12 DRAM chips using more than 60,000 TSV holes, while maintaining the same thickness as current 8-layer packages. The thickness of the package (720㎛) remains the same as current 8-layer High Bandwidth Memory-2 (HBM2) products. This will help customers release next-generation, ...

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CMOS image sensor market growing at 10%

Thanks to mobile demand, the  CMOS image sensor (CIS) market is expected to grow 10% this year, says Yole Développement, and to reach $6.4 billion in Q4. CIS’  growth has seen the market reach $15.5 billion in 2018. CIS  has its own growth engine – powered by the proliferation of cameras in mobile, which have hit ...

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Radio wave ranging sensors detect people

Socionext is sampling a set of radio-wave ranging sensors providing highly sensitive, low-power sensor technology for a broad range of smart home and IoT devices. The SC1230 Series includes two products that can detect the location and movement of individuals with ultra-high degrees of sensitivity. The SC1232AR3 measures the presence and the distance of an ...

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12MP image sensor has SCG for low light/dynamic range balance

OmniVision is sampling a 1.4 micron 12 MP image sensor with selective conversion gain (SCG) for the optimum balance between low-light image quality and high dynamic range (HDR).  The OV12D features a  1/2.4” optical format, on-chip 4-cell remosaic color filter, high speed phase-detection autofocus (PDAF) and extra pixels for 4K2K video electronic image stabilization (EIS).  ...

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Risc-V day: Andes offers IP cores, accelerators, tools, and even a free core

Taiwanese IP provider Andes Technology is offering RISC-V cores, acceleration hardware and development tools. Amongst planned cores is a free one. “With ‘Fast start’ into Risc-V, we will not only introduce our free starter, commercial grade core but also show which other options available, ranging from an ultra-low power MCU over a low power medium-sized Core ...

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RS Components introduces IIoT development box from Toi

RS Components has introduced the 4ZeroBox IIoT unit from Italian manufacturer Toi (Things on Internet). 4ZeroBox is the hardware component of Toi’s 4Zero platform, a plug-and-play data gathering, processing and reporting system designed for smart manufacturing and factory-maintenance applications. 4ZeroBox is a modular IIoT unit that can be installed into both legacy and modern industrial ...

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UK-wide Big Assembly to promote engineering careers to students

On Wednesday 6 November at 10:30am, as part of Tomorrow’s Engineers Week, hundreds of engineers will star in the Big Assembly, a live-streamed event to promote engineering careers to young people. Over 850 schools are hoped to sign up to the event, which will take place at The Chase School in Malvern and be broadcast ...

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Adesto and Cadence collaborate on xSPI ecosystem for IoT devices

Adesto Technologies Corporation and Cadence Design Systems have announced a collaboration to expand the ecosystem around the expanded serial peripheral interface (xSPI) communication protocol to enable higher transfer rates and lower latency for flash memory in IoT devices. The Cadence memory model for xSPI enables use of the octal NOR flash with the host processor ...

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