RS Components meets harsh-environment standards with steel connectors

RS Components has introduced the TE Connectivity Amplimite D-subminiature range of stainless steel connectors, which combine salt spray resistance with RoHS compliance, without the use of toxic cadmium plating. Designed to meet the performance requirements of MIL-DTL-24308, Amplimite D-subminiatures are suitable for electronic and industrial design engineers working on military and aerospace projects such as weapons ...

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GaN FET aids vehicle lidar systems’ accuracy

A 15V gallium nitride (GaN) FET has been added to the eGaN offering from Efficient Power Conversion (EPC). The automotive-qualified EPC2216 is designed for lidar applications in self-driving cars and can also be specified in other time-of-flight (ToF) systems, such as facial recognition, healthcare, warehouse automation, drones, mapping and smart advertising systems. The 26mΩ, eGaN ...

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Taiwanese IoT hardware vendor Advantech focuses on Europe

Advantech is a Taiwanese vendor of IoT hardware for sectors including healthcare, retail, factory and logistics. EW recently spoke with Michael Kreft, head of global sales at Advantech to discuss the company’s expansion efforts in Europe (its fastest-growing region last year), and the region-specific challenges it has faced. The company’s structure comprises three groups addressing ...

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Hakko signs HK Wentworth as sole UK distributor

Soldering, de-soldering, PCB rework and fume extraction equipment by Hakko is available in the UK from HK Wentworth, following an agreement that the latter will be the sole authorised distributor of Hakko products in the United Kingdom and Northern Ireland. Following HK Wentworth’s recent acquisition of the UK’s previous distributor of Hakko tools, Dancap Electronics, ...

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X-Fab adds flash and EEPROM functions to 180nm platform

X-Fab Silicon Foundries SE has announced the availability of Sonos-based flash and embedded EEPROM on its XT018 BCD-on-SOI platform. The addition of these non-volatile memory elements will open up a broader array of applications where high-voltage ratings and resilience to elevated temperatures need to be coupled with enhanced computational capabilities. The EEPROM part is designed ...

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Polymer film makes better headphones and phone speakers

Aiming at micro-speakers in phones and headphones, Victrex (formerly ICI) has launched a higher-performance structural plastic film for diaphragms. “Victrex has announced the launch of an ultrathin APTIV DBX film product line,” said the firm. “The new films´ tighter thickness tolerance is designed to result in a more uniform thickness to enable laminators, speaker builders ...

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28nm represents 49% of installed capacity

Leading-edge processes (<28nm) took over as the largest portion in terms of monthly installed capacity available in 2015, says iC Insights. By the end of 2019, <28nm capacity is forecast to represent about 49% of the IC industry’s total capacity, based on IC Insights’ Global Wafer Capacity 2019-2023 report. At the very leading edge, <10nm ...

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Panasonic, IBM to co-develop semi process

IBM and Panasonic are to co-develop and market a new high-value-added system to optimize the overall equipment effectiveness of  customers’ semiconductor manufacturing processes. Panasonic currently develops and markets edge devices and manufacturing methods that contribute to improving semiconductor manufacturing of advanced packaging.  These new devices and methods include dry etching equipment, plasma dicers, plasma cleaners ...

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60GHz gesture recognition chip

Infineon has developed a 60 GHz radar chip for gesture recognition. It is used in Google’s Pixel 4 phone. With an integrated antenna system, it senses the presence and movement of people and objects  or measures distances and speeds. “With our radar technology, devices become ‘context-aware,” says Infineon’s Andreas Urschitz. Infineon’s radar technology has its ...

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