GLOBALFOUNDRIES says it has taped-out a 12nm LP FinFet Arm-based 3D test chip for computing, AI/ML and wireless applications. The chip has Arm’s mesh interconnect technology in 3D that allows data to take a more direct path to other cores, minimizing latency while increasing data transfer rates as demanded by data centers, edge computing and ...

This story continues at GloFo tapes out 3D DFT test chip

Or just read more coverage at Electronics Weekly