Imec has presented a dual-damascene 21nm pitch test vehicle relevant for manufacturing the 3nm logic technology node. With this test vehicle, a 30% improvement in resistance-capacitance product (RC) was obtained compared to previous generations, without impacting reliability. The need for implementing scaling boosters such as self-aligned vias and self-aligned blocks in 3nm and beyond interconnect ...

This story continues at Imec presents dual-damascene approach to 3nm BEOL processing

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