Kyocera and Vicor will develop power-on-package (PoP) technology for high-performance and artificial intelligence (AI) processors. Kyocera will integrate processor power and data delivery with organic packages, module substrates and motherboard designs – using its design technology, simulation tools and manufacturing experience to route I/O, high-speed memory and high-current power. Vicor will provide current multipliers ready ...

This story continues at Kyocera and Vicor create ‘power-on-package’ for AI processors

Or just read more coverage at Electronics Weekly