APEC: SiC power and improved cloud-based power tools

On Semiconductor will be showing enhancements to its cloud-based power development tool, branded Strata, which it announced at CES earlier this year. Search capabilities have been improved, and there is a carousel-style menu that allows compatible devices and boards to be selected, said the firm: “Engineers are able to narrow down viable component and systems ...

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APEC: Heat sinking film is flexible despite high conductivity

Toyochem will be showcasing its Lioelm FTS series of thermally conductive adhesive sheets for bonding substrates to heatsinks, or for use as an insulating layer in power device packaging. According to the firm, it has used heat-resistant resins to get around performance trade-offs between the elastic modulus and thermal resistance that typically arise with conventional ...

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Dengrove adds space-saving DC/DC converters from Recom

Available in a DOSA (Distributed power Open Standards Alliance) footprint, and just 3.75mm high, the Recom RPM3.3 and RPM5.0, non-isolated DC-DC converters are now available from Dengrove Electronic Components. They are designed for applications that require high power density and high efficiency and have power ratings from 3.3W to 30W. They comply with the  industry standard DOSA ...

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Google calculates Pi to 30 trillion digits on its Cloud

To celebrate Pi day, Google has calculated Pi to more digits than ever before: 31,415,926,535,897 digits to be exact, which adds a touch of class. The computer was the firm’s own Cloud, “using cloud tcompiting which is the first time this has ever been done”, said Google. 25 Google Cloud virtual machines were used, running an ...

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Semi manufacturing equipment spend expected to decline 14% this year and grow 27% next year

Spending on semiconductor manufacturing equipment is expected to decline 14% to $53 billion in 2019, but grow 27% next year  to set a new record, says SEMI. Spurred by a slowdown in the memory sector, the 2019 downturn marks the end of a three-year growth run for fab equipment spending. Over the past two years, ...

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Toshiba offers 2.5 inch SSD.

Toshiba has made its XD5 Series NVMe SSD platform available in a 2.5-inch, 7mm low-profile form factor that is optimized for low-latency and performance consistency in read-intensive workloads. Developed for both data center and cloud environments, the new 2.5-inch form factor XD5 Series is suitable for NoSQL databases, large-scale-out data mining and analysis, and streaming ...

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1st military-qualified Arm processor for hi-rel applications

Teledyne e2v is claiming a first: military-qualified Arm-based processor – in this case a version of NXP’s LS1046A guaranteed for operation at -55°C to 125°C in aerospace and defence applications. LS1046A is part of NXP’s 64-bit Arm Layerscape portfolio, with a 1.8GHz quad-core Arm Cortex-A72. In includes packet processing acceleration and high-speed peripherals “and is recognised ...

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