Magnetic switch with integrated ASIL-B self-test for auto-driving cars

Functional safety applications such as automated driving are the target of a pair of Hall sensors from Allegro MicroSystems. They are pin-compatible upgrades for existing three-wire Hall switch and latch ICs, developed in accordance with ISO 26262:2011 with ASIL-B capability (pending assessment). APS11450 devices are unipolar switches APS12450 devices are bipolar latches Self-test features are integrated, ...

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Nexperia aims at cars with 250mA LED driver

Nexperia has extended its constant current LED driver family with eight new AEC-Q101 qualified devices that deliver up to 250mA. The 16V NCR32xx and 40V NCR42xx series are available in two package styles, the smaller SOT457 (SC-74) or higher power SOT223 (SC-73) – the latter which works up to 1.25W. Output is stabilised at 10mA ...

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World’s longest flexible PCB comes from Gloucestershire

Trackwise of Tewkesbury is claiming a world record – for creating what is believed to be the world’s longest multi-layer flexible printed circuit (FPC), which will span 26m 
(85 feet) within the wings of an unmanned aerial vehicle to distribute power and control signals. It is a solar-powered plane, and the flexi is claimed to ...

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AI module puts twin Movidius Myriad X on m.2 board for vision processing

Aaeon has build two Intel Movidius Myriad X AI processors onto a 22x80mm m.2 standard module for vision processing. Called ‘AI Core XM2280’, it is capable of up to 200frame/s (160 typical) and over 2 trillion floating point operations per second as a dedicated neural network accelerator. It is compatible with Intel’s OpenVINO tool kit ...

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Toshiba samples auto flash

Toshiba is sampling automotive JEDEC UFS Version 2.1 3D flash which operate from -40°C to +105°C, meet AEC-Q100 Grade2 and come in four capacities: 32GB, 64GB, 128GB, and 256GB[5]. The UFS devices have Refresh, Thermal Control and Extended Diagnosis. The Refresh function can be used to refresh data stored in UFS, and helps to extend the data’s lifespan. ...

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Arm and Samsung to offer 18nm physical IP platform

Arm’s Physical Design Group and Samsung Foundry intend to offer, by the end of the year, an 18nm FDSOI physical IP foundry platform which includes an eMRAM compiler and three Arm POP IP packages for Arm Cortex-A55, Cortex-R52 and Cortex-M33 processor IP. 18FDS is lower cost with lower power and the same BEOL as 14nm FinFET. It ...

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SiP is the answer to connecting 5G modems to the network

5G will redefine how the RF front-end interacts in-between the network and the modem, asserts Yole Developpement. Key to this is SiP technology, says Yole, because it allows  the implementation of an increasing number of bands with its ability to put many ICs, package assembly and test technologies in the same package.  The RF SiP ...

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February SEMI Billings down 1.7% on January

February billings of semiconductor manufacturing equipment were worth $1.86 billion says SMI which was 1.7% less than the $1.9 billion of January billings. The February figure was 23% lower than the February 2018 billings figure of $2.4 billion. “Global billings of North American equipment suppliers continued a decline that began in November 2018,” says SEMI’s ...

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Littelfuse adds to SiC Schottky Diodes

Littelfuse has added to its 650V, AEC-Q101-qualified SiC Schottky Diodes with the LSIC2SD065DxxA Series SiC Schottky Diode is available with current ratings of 6A, 10A, or 16A in a TO‑263-2L package and the LSIC2SD065ExxCCA Series SiC Schottky Diode is available with current ratings of 12A, 16A, 20A, or 40A in a TO-247-3L package. Typical applications include: ...

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