Xilinx and auto driveline specialist ZF Friedrichshafen AG (ZF) are to collaborate on ZF’s AI-based automoted driving control unit – the ZF ProAI. ZF is using the Xilinx ZynqUltraScale+ MPSoC platform to handle real-time data aggregation, pre-processing, and distribution, as well as to provide compute acceleration for the AI processing in ZF’s new AI-based electronic ...

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Infineon and TTTech Auto have available a second generation of their integrated automotive-grade safety solution for automated driving use cases. It is based on Infineon’s AURIX TC397XM microcontroller and TTTech Auto’s MotionWise safety software platform. It delivers full support and scalability for level 2+ solutions up to the advanced levels 4 and 5 of automated ...

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AMS is joining Chinese face recognition specialist Face++ to produce 3D image sensors. The move reduce AMS’  its dependence in Apple and gets it into the Android phone market. “By linking our 3D sensing systems with Face++ technology, we are enabling manufacturers to add these popular features to their products quickly and smoothly,” says AMS’s ...

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Worldwide semiconductor revenue totalled $476.7 billion in 2018, a 13.4% increase from 2017, says Gartner. Memory accounted for 34.8% of total semiconductor revenue, up from 31% in 2017. “While 2018 continued to build on the growth established in 2017, the overall gains driven by memory were at half the 2017 growth rate,” says Gartner vp ...

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Huawei has announced its Kunpeng 920 server CPU and new servers  Called TaiShan. “The ARM industry is seeing a new development opportunity, “ says Chief Strategy Officer William Xu, “the Kunpeng 920 CPU and TaiShan servers newly released by Huawei are primarily used in big data, distributed storage, and ARM-native applications. “ Kunpeng 920 is ...

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Toshiba has developed Deep Neural Network (DNN) hardware IP  that will help to realize ADAS and autonomous driving functions. The company will integrate the DNN hardware IP with conventional image processing technology and start sample shipments of Visconti5, the next generation of Toshiba’s image-recognition processor, in September 2019. The DNN hardware IP draws on deep learning to ...

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CEVA has announced CEVA-BX – an all-purpose, hybrid DSP / Controller architecture to address algorithms of digital signal processing in voice, video, communication, sensing and digital signal control applications. Offering general purpose DSP capabilities required for motor control and electrification, the CEVA-BX architecture extends CEVA’s market reach into the automotive and industrial markets currently underserved ...

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A number of ‘smart homes’ with digitally savvy older people demonstrating tech in their own homes are being created as part of a DCMS (Department for Culture Media and Sport) scheme to boost the nation’s digital skills. The homes, to be created in rural West Essex by a partnership led by Uttlesford Council for Voluntary ...

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Smiths Interconnect is shipping its SpaceNXT Aurora Series, claimed to be the first COTS Plus 2mm Hard Metric backplane connector,  tested  and  qualified  to  ESA  ESCC  3401 specifications. The Aurora  family  of  Hard  Metric  backplane  connectors  is  part  of  Smiths Interconnect’s SpaceNXT initiative, creatinga broad range of high-reliability connectivity solutions that are readily available to ...

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