ST revenues up 15.8%; profit up 11.5%

ST had Q4 revenues of $2.65 billion, gross margin of 40.0%, operating margin of 16.8%, and net income of $418 million. ST CEO Jean-Marc Chery (pictured) commented: “ST delivered a solid performance in the fourth quarter, with net revenues and operating income increasing sequentially 5.0% and 11.5%, respectively. “Net revenues in 2018 increased by 15.8% year-over-year ...

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Imec on AI

This is the second of a series of essays by Imec scientists on the future of electronics technology. This one is called: ‘AI systems will become our workmates. Workmates we understand and trust.’ It is by Pieter Ballon, director of SMIT – an Imec research group. Artificial intelligence, or AI is all the rage again. ...

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TI revenues flat

TI’s Q1 revenues were 1% down on Q4. Q1 revenue was $3.72 billion down from Q4’s $3.75 billion. Q1 net income was $1.24 billion up from Q4’s $344 million due to income taz. Rich Templeton, TI’s chairman, president and CEO, made the following comments: “Revenue decreased 1 percent from the same quarter a year ago ...

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China chip growth slowing

The growth of China’s semiconductor industry will slow to 16.2%  this year – the lowest in five years, says TrendForce. TrendForce says the China IC industry was worth $88.4 billion in 2018 and will be worth $107 billion this year. Challenges for China’s semiconductor industry include the global economic slowdown, the overall weak demand, the negative ...

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Mouser signs Pyreos

Mouser has signed a global distribution agreement with Pyreos, a U.K.-based passive infrared sensor developer and manufacturer. Through the agreement, Mouser is now stocking a variety of Pyreos’ mid-infrared detectors for applications in air quality, breath measurement for medical applications, gas and flame detection, motion, and gesture. The Pyreos product line includes ezPyro digital SMD pyroelectric ...

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UFS Ver. 3.0 embedded flash

Toshiba is sampling what it claims to be the industry’s first Universal Flash Storage (UFS) Ver. 3.0 embedded flash memory devices. The new lineup utilizes the company’s  96-layer BiCS FLASH 3D flash memory and is available in three capacities: 128 gigabytes, 256GB and 512GB. With high-speed read/write performance and low power consumption, the new devices are suitable  for ...

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