Toshiba has developed a prototype 96-layer BiCS FLASH, memory using 3D flash quad level cell (QLC) technology. The IC achieves the industry’s maximum capacity of 1.33 terabits for a single chip. This also realises an unparalleled capacity of 2.66 terabytes in a single package by utilising a 16-chip stacked architecture. The huge volumes of data generated ...

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