Panduit jack blowout devices secure networks

The range of RJ45 jack blockout devices from Panduit ensures the safety and security of a network infrastructure. Compatible with most RJ45 openings, the blockout device snaps into the RJ45 opening and can only be released using a special removal tool, thus preventing unauthorized access to the network, and saving time and money associated with ...

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Panel V/A/W meter has touch sensing

For displaying voltage, current and power up to 96kW, comes Murata’s DCM20 series of multi-function panel meters with 9.2mm digits. Red is standard, with claimed reading range up to 5m, and green or blue are options. In a one-piece 53.3 x 36.3mm polycarbonate housing, that fits into ‘0U’ and ‘1U’ racks. Threaded mounting studs and caged terminal blocks ...

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Cortex-M4 MCU has 11 FlexComm interfaces

By including 11 FlexComm interfaces for user interfaces and sensors, NXP has designed its LPC540xx microcontrollers for applications that require data aggregation from multiple inputs “allowing developers to adapt to the communication and connectivity requirements of various IoT, building automation, data collectors and diagnostic equipment. Inside is a 180MHz Arm Cortex-M4 processor with 360kbyte of ram and ...

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TTI buys Compona

Berkshire Hathaway subisidiary TTI  has bought Compona of Switzerland and Compona’s German subsidiary Cosy Electronics. Both Compona and Cosy are specialty distributors of interconnect products and provide services such as in-house assembly of specific connector ranges and full support on custom cable harnesses. Compona CEO, Riet Morell, will continue to lead Compona  reporting to Glyn Dennehy, TTI ...

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Cryogenic connectors and cables

  Intelliconnect (Europe) has launched CryoCoax, a separate brand for its cryogenic connectors and cable assemblies. “The CryoCoax range of connectors includes sturdily-constructed stainless steel interconnects including SMA, SMP, custom designed products and all common connector interfaces,” said Intelliconnect. They “are used across applications including measurement, test, system quantum computing, space and instrumentation.” IP68 and glass-sealed ...

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Leti and Soitec combine for substrate R&D

Leti and Soitec have agreed a five-year partnership to drive the R&D of advanced engineered substrates. This agreemen launches a  prototyping hub for equipment partners to pioneer new materials. The Substrate Innovation Center will offer access to Leti-Soitec expertise around a focused pilot line. Key benefits for partners include access to early exploratory sampling and ...

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TI sampling smaller DLP controllers

TI is sampling  DLP Pico controllers that deliver advanced light control capabilities in smaller form factors for mass-market 3D scanners and 3D printers. DLPC347x controllers offer the micron-to-sub-millimeter resolution. Developers can pair the DLPC3470, DLPC3478 or DLPC3479 controller with one of four existing DLP Pico digital micromirror devices (DMDs) to design a variety of battery-powered and ...

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Industry over-spending on NAND capex

Overspending by the major NAND suppliers is expected to further cool NAND flash prices this year, reports IC Insights.   Figure 1 compares the estimated required capex needed to increase NAND flash bit volume shipments 40% per year, sourced from a chart from Micron’s 2018 Analyst and Investor Event in May of this year, versus ...

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Imec integrates finfets and photonics for transceivers

Imec has demonstrated ultra-low power, high-bandwidth optical transceivers through hybrid integration of Silicon Photonics and FinFET CMOS technologies. With a dynamic power consumption of only 230fJ/bit and a footprint of just 0.025mm2, the 40Gb/s non-return-to-zero optical transceivers mark an important milestone in realizing ultra-dense, multi-Tb/s optical I/O solutions for next-generation high-performance computing applications. The exponentially ...

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