GloFo and eVaderis develop MRAM for MCU on 22nm FD-SOI

Globalfoundries and eVaderis are co-developing an MCU reference design using GF’s embedded eMRAM technology on GloFo’s 22nm FD-SOI  platform to  support applications such as battery-powered IoT products, consumer and industrial microcontrollers, and automotive controllers. “Utilizing GF’s eMRAM as a working memory allows sections of the eVaderis MCU to power cycle frequently, without incurring the typical MCU ...

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Arrow signs Ultrahaptics

Ultrahaptics has signed a worldwide distribution agreement with Arrow. Ultrahaptics’ mid-air haptic technology  projects tactile sensations directly onto a users’ hands, using ultrasound. The technology is being used in a wide range of fields, such as increasing driver safety through tactile feedback for gesture-based applications and enabling the sense of presence in interactions with virtual and ...

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EW: Bridgetek launches graphic controllers for EVE

Further extending its embedded video engine (EVE) product offering, Bridgetek has introduced the BT815/6 series of graphic controller ICs for next generation HMI development. Support for the Adaptive Scalable Texture Compression (ASTC) algorithm means that image quality can be significantly enhanced without needing greater bandwidth to be allocated as the compression algorithm allows for smaller ...

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MWC: Toshiba shows additions to EXCERIA microSDXC cards

Toshiba  has announced three new additions to the EXCERIA family of microSDXC cards, named M303. With capacities of up to 256GB maximum read/write speeds of 98MB/s and 65MB/s respectively, as well as a new Video Speed Class 30 (V30), the M303 allows users to record and store 4K Ultra HD content. The M303’s speed rating ...

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MWC: Infineon adds to mobile security solution

Infineon has expanded its embedded Secure Element (eSE) product family for mobile systems with OS, apps and NFC modem wrapped up in one. The Infineon solution demonstrates an accelerated transaction time. It supports a  range of applications, such as identification, payment, ticketing and embedded SIMs (eSIM). Consumers in densely populated areas desire faster transaction speeds ...

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Qualcomm and Broadcom agree non-price-related conditions of takeover.

The Chairman of Qualcomm has written to the CEO of Broadcom saying that the conditions for a takeover of Qualcomm have been agreed except for the condition of price. Qualcomm is offering a break-up fee to Broadcom of 9% of enterprise value ($7.38 billion) if regulatory approval is refused by any fault of Qualcomm. Broadcom ...

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MWC: Ericsson can supply 5G infrastructure this year

Ericsson CEO Börje Ekholm (pictured)  told the MWC audience that  Ericsson can supply operators with 5G infrastructure as from Q4. Ekolm said that the commercial deployment of 5G will initially be for mobile broadband. “We believe network slicing is critical as we move into the 5G world; we performed a joint study with DT that ...

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Embedded World 2018: Preview of the show

Embedded World is Europe’s largest showcase for embedded components and systems where over 1,000 exhibitors will show their wares across six halls of the Nuremberg Messe. Embedded World is by no means a Europe-only show. The big chip firms exhibiting include Broadcom, Microchip/Atmel, Canonical (Ubuntu), Epson, Fujitsu, Infineon, Intel, Renesas, Rohm and Xilinx to name ...

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MWC 2018 Opens

MWC 2018 opens today against the backdrop of the first y-o-y (Q4-on-Q4) decline in smartphone shipments as measured by Gartner. Yesterday, a number of companies held previews of their wares. Nokia CEO Rajeev Suri said the company it would combine its WPON technology with Facebook’s 60MHz Terragraph technology to deliver gigabit broadband to the home ...

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