TI is sampling a new generation of DLP technology for in-vehicle head-up display (HUD) systems. The new DLP3030-Q1 chipset, along with supporting evaluation modules (EVMs), gives automakers and Tier-1 suppliers the ability to bring bright, dynamic AR displays to windshields and place critical information within the driver’s line of sight. The automotive-qualified DLP3030-Q1 chipset allows ...

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