BT’s mobile operator EE has demonstrated 2.8Gbit/s download speeds across an end-to-end 5G test network in its UK mobile lab. EE described this as an important breakthrough test in the work to deploy 5G networks implementing 64×64 Massive MIMO active antenna unit broadcasting. Massive MIMO is believed to be crucial for successful deployment of 5G ...
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A pill to treat schizophrenia containing a sensor that tracks whether the medication has been taken has won the approval of the US regulators.
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SDRplay, the Wakefield software defined radio specialist, upgrades its RSP1 entry level SDR receiver
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Imec makes a neural probe for the parallel recording of hundreds of neural signals.
This story continues at Imec neural probe records signals from hundreds of neurons
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Q3 DRAM revenue hit a new high with a 16.2% sequential increase and expects a further 10% increase in Q4, reports DRAMeXchange Contract prices of various DRAM products jumped by about 5% on average in Q3 from Q2 on the back of the year-end busy season and limited bit supply growth. . “Most PC-OEMs have ...
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Socionext develops an 8K/4K compatible media player equipped with the company's 8K HEVC decoder chip.
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Fujitsu Labs has developed a security technology for executing transactions in virtual currencies using blockchain. Fujitsu calls its technology “ConnectionChain”. A great deal of attention has recently been focused on virtual currency exchange among individuals and companies using initial coin offerings (ICOs) to raise capital from the sale of virtual currencies. Settlement between virtual ...
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The Prime Minister is to meet leading digital entrepreneurs and innovators as she announced a series of measures to support the UK’s tech sector. In the run up to the Budget, the Prime Minister and Chancellor will co-host a tech roundtable and reception at Downing Street, and reaffirm the Government’s enduring commitment to this vital industry. ...
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Osram has created photodiodes that can be soldered without any damage up to one year after initial contact with air, claiming that comparable products only last three days. “Developers at Osram Opto Semiconductors have significantly improved the moisture sensitivity level,” said Osram, “This applies to storage of the component under defined conditions at a temperature ...
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Leti, an institute of CEA Tech, has announced the world’s first successful 300mm wafer-to-wafer direct hybrid bonding with pitch dimension connections as small as 1µm and copper pads as small as 500nm. This was achieved in partnership with EV Group, a supplier of wafer bonding and lithography equipment. “To our knowledge, this is the first ...
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