Nexperia, the former Standard Products division of NXP, has brought out a range of 80V dual Power-SO8 MOSFETs in LFPAK56D packages. With the addition of this new 80V range of MOSFETs Nexperia now has devices, ranging from 30V to 100V. LFPAK56D is automotive qualified to AEC-Q101 and the copper clip gull wing package technology is for ...
This story continues at Nexperia adds 80V MOSFETs
Or just read more coverage at Electronics Weekly
Arduino has two new boards out which deliver connectivity – the Arduino MKR WAN 1300 (LoRa) and the Arduino MKR GSM 1400. The Arduino MKR WAN 1300 delivers LoRa low-power WAN connectivity, and the Arduino MKR GSM 1400 adds global 2G/3G communications capability. Both boards measure 67.64 x 25mm and,with low power consumption, are suitable ...
This story continues at Two new Arduino boards offer connectivity
Or just read more coverage at Electronics Weekly
LED make Osram has revealed the prototype for its thousand pixel matrix headlight LED. By pixelating the light source, arbitrary headlight beam patters can be created, extending the concept of main/dip beam to complex beam shapes that minimise dazzle while maximising useful illumination for the driver. Sketch of Eviyos Branded Eviyos, the 1,024 pixels are ...
This story continues at Osram reveals future of LED automotive headlights
Or just read more coverage at Electronics Weekly
Globalfoundries will roll out a 12nm finfet process at its New York fab next year which is 15% denser with 10% better performance than its 14nm process. “We plan to introduce new client and graphics products based on GF’s 12nm process technology in 2018 as a part of our focus on accelerating our product and ...
This story continues at GloFo brings on 12nm finfet process
Or just read more coverage at Electronics Weekly
The already constrained supply of wafers is about to tighten further, reports Digitimes. 3D NAND, Chinese foundries and China memory fabs are driving 12 inch demand. LCD driver ICs, fingerprint sensors, power management ICs and CMOS image sensors are driving 8-inch demand. Wafer suppliers are in no hurry to increase capacity having been caught out ...
This story continues at Wafers short till 2020
Or just read more coverage at Electronics Weekly
HERE, the road-mapping company owned by BMW, Audi and Mercedes, spent $767 million on R&D in 2016, reports Reuters. HERE was bought by the Germans for €2.55 billion euros in 2015. A 15% stake was sold to Intel earlier this year. Another, smaller, stake was sold to Pioneer and a 10% stake was sold to ...
This story continues at HERE spent $767 million in 2016 on hi-res mapping for driverless cars
Or just read more coverage at Electronics Weekly
