Imec has developed an electrically functional solution for the 5nm back-end-of-line (BEOL). The solution is a full dual-damascene module in combination with multi-patterning and multi-blocking. Scaling boosters and aggressive design rules pave the way to even smaller dimensions. As R&D progresses towards the 5nm technology node, the tiny Cu wiring schemes in the chips’ BEOL ...

This story continues at Imec develops 5nm BEOL

Or just read more coverage at Electronics Weekly