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UKRI announces full list of 16 semiconductor projects getting government funding

October 1, 2024
david manners

UKRI has announced the 16 semiconductor projects sharing £11.5 million  to scale up semiconductor manufacturing, improve supply chain resilience, establish innovations and new manufacturing techniques, expand the capability or performance ...

The post UKRI announces full list of 16 semiconductor projects getting government funding appeared first on Electronics Weekly.

Sony adds 50MP CIS

October 1, 2024
david manners

Sony has expanded its LYTIA image sensor portfolio with a 50MP CIS designed for high-end and flagship smartphone cameras designated LYT-818. The device has a sensor size of 1/1.28″ and ...

The post Sony adds 50MP CIS appeared first on Electronics Weekly.

Melexis expands Triaxis magnetic sensing IC range

October 1, 2024
david manners

Melexis has expanded its Triaxis magnetic sensing IC range with stacked dual-die variants of the MLX90425 and MLX90426. Featuring a 5 mT stray field immunity (SFI) and 360° rotary detection ...

The post Melexis expands Triaxis magnetic sensing IC range appeared first on Electronics Weekly.

Samsung MLCCs target high-voltage demands of EV industry

October 1, 2024
Alun Williams

Samsung is releasing a new range of MLCCs (multi-layer ceramic capacitors) aimed at the electric vehicle (EV) industry, meeting demand for high rated voltage systems. Specifically, Samsung Electro-Mechanics is releasing ...

The post Samsung MLCCs target high-voltage demands of EV industry appeared first on Electronics Weekly.

JOT Introduces Modular Automated Microfactory Concept

September 30, 2024
Electronics Assembly

OULU, Finland—JOT Automation Inc. and EID Robotics have introduced a system of standardized, modular, robotic cells that can be combined to create microfactories for localized automated manufacturing of products.

24Gbit/s UCIe chiplet-to-chiplet IP demonstrated at 3nm

September 30, 2024
steve bush

Alphawave Semi has unveiled 3nm UCIe (universal chiplet interconnect express) die-to-die communication intellectual property, which has been demonstrated with TSMC’s chip-on-wafer-on-substrate (CoWoS) packaging. “This complete PHY and controller subsystem, developed ...

The post 24Gbit/s UCIe chiplet-to-chiplet IP demonstrated at 3nm appeared first on Electronics Weekly.

GaN LEDs and power transistors on the same chip

September 30, 2024
steve bush

Gallium nitride-based LEDs and power transistors can be made on the same IC, according to scientists from Cornell University and the Polish Academy of Sciences. The trick is to used ...

The post GaN LEDs and power transistors on the same chip appeared first on Electronics Weekly.

ASIL B EV battery current sensor spans ±1,500A

September 30, 2024
steve bush

LEM is aiming at electric vehicle state-of-charge estimation with a ±1.5kA current sensor. Designed to be built into the ‘battery disconnect unit’, the HSTBV series can “reach 1% of accuracy ...

The post ASIL B EV battery current sensor spans ±1,500A appeared first on Electronics Weekly.

Equal1 signs MoU with Nvidia for quantum computing tech

September 30, 2024
Caroline Hayes

Irish quantum computing startup, Equal1 has signed a MoU with Nvidia to collaborate on quantum computing technology use cases, business models and proof of concept, focusing on integrating and validating ...

The post Equal1 signs MoU with Nvidia for quantum computing tech appeared first on Electronics Weekly.

Korean inventory falling faster

September 30, 2024
david manners

August  chip inventories in Korea fell at the fastest rate for five years thanks to the  demand for memory, reports Statistics Korea. Inventories were down 42.6% y-o-y. In July they ...

The post Korean inventory falling faster appeared first on Electronics Weekly.

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