Broadcom is shipping its 3.5D eXtreme Dimension System in Package (XDSiPTM) platform technology which enables consumer AI customers to develop custom accelerators (XPUs). The 3.5D XDSiP integrates more than 6000 ...
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Nexperia has brought out a portfolio of logic ICs in tiny automotive-qualified MicroPak XSON5 leadless packaging. MicroPak XSON5 is a thermally enhanced plastic enclosure with a 75% smaller PCB footprint ...
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BBN Technologies, of the RTX Group, is working to deliver a prototype photonic chip that uses exotic quantum states of “squeezed light”. It is part of DARPA’s INSPIRED (Intensity Squeezed ...
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The European Space Agency (ESA) has committed to a deeper working relationship with the Japanese Space Agency (JAXA). They will be collaborating to explore asteroids, the Moon, and Mars… The ...
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Intel’s 18A process is on schedule and developing as expected, Naga Chandrasekaran, Intel’s chief global operations officer and GM of the company’s foundry business, told yesterday’s UBS Global Technology and ...
The post Intel’s 18A on-track for production ramp next year, says foundry GM appeared first on Electronics Weekly.
Scientists in Stuttgart are using quantum sensors to detect the nerve signals in peoples’ limbs for the control of prosthetics as an alternative to implanting electrodes. The quantum magnetometers will ...
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Pure Storage, the CIA-backed data storage specialist, and Kioxia are joining up to supply storage to hyperscalers. The two companies will deliver a data storage platform engineered from the ground ...
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Asahi Kasei Microdevices (AKM) is shipping has its new InAs Hall element, the HQ0A11. HQ0A11 features AKM’s smallest and thinnest package size for an InAs-based Hall element, measuring 0.8 x ...
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In what will be a blow to the rival Scottish spaceport at Southerland, Orbex has decided to switch its launch operations to Shetland, at the SaxaVord Spaceport. Orbex – the ...
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A UK consortium is setting up the Virtual Reality Semiconductor Fabrication Training Facility (VRSFT), funded by a £500,000 Innovate UK grant. It is being delivered by a partnership of: semiconductor ...
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