DigiKey has signed a global distribution partnership with Qorvo for its power and connectivity product lines. Under the terms of the agreement, DigiKey will distribute Qorvo’s portfolio across across North ...
The post DigiKey signs Qorvo for power and RF appeared first on Electronics Weekly.
Amphenol has released the QEPT 4-TRX 200G NRZ, a 200Gbit per second high-speed optical pluggable transceiver module. The QEPT (Quad Embedded Pluggable Transceiver), capable of 56Gbit per second at distances ...
The post Optical pluggable transceiver stretches data rates and distances appeared first on Electronics Weekly.
Nanotec has introduced a series of frame-less brush-less dc motors – essentially a stator-plus-rotor kit intended to be installed directly into a physical structure that will provide support, alignment and ...
The post Frame-less motors for ultimate space-saving appeared first on Electronics Weekly.
Advantech has put Intel’s Atom x7211RE at the center of an industrial PC measuring only 100 x 70 x 40mm. Called UNO-2271G V3, its dual-core processor is supported by 8Gbyte ...
The post Atom x7211RE industrial PC is only 100mm across appeared first on Electronics Weekly.
Samsung has ten months to get its 2nm process yielding if it is to see a recovery in its foundry business, reports the Korean newspaper Chosun. Samsung’s 3nm process, its ...
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The compound semiconductor market is on a CAGR of nearly 13% between 2024 and 2030 and is set to hit $25 billion by 2030, says Yole Group, fuelled by growth ...
The post Compound semi market to be worth $25bn by 3030 appeared first on Electronics Weekly.
Magdrive, a UK space tech startup, has successfully raised $10.5 million in seed funding. The round was lead by the VC Redalpine. Balerion, Alumni Ventures, Outsized Ventures, 7percent, and Entrepreneur ...
The post Magdrive raises $10.5m seed funding for novel propulsion systems appeared first on Electronics Weekly.
The 75th annual IEEE Electronic Components and Technology Conference (ECTC) will take place from May 27-30, 2025 at the Gaylord Texan Resort & Convention Centre. ECTC combines packaging, components, and ...
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Intel has put back its $100 billion Ohio chip project until 2030 or 2031. The first fab in the multi-fab project will not be completed until 2030. It had been ...
The post Intel delays Ohio fab till 2030 appeared first on Electronics Weekly.
The VITA 100 standard will build on VPX’s legacy but “leapfrog” to meet increased processing and power demands. Providing a progress update, VITA 100 chair Steve Devore (pictured), described it ...
The post VITA 100 unveiled as “new era for embedded standards” appeared first on Electronics Weekly.
