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Embedded World: Seeding the ground for automotive RISC-V

March 6, 2025
steve bush

Infineon is launching a RISC-V starter kit for a family of automotive microcontrollers to be released “within the coming years”, the company said. “In software-defined vehicles, RISC-V is key to ...

The post Embedded World: Seeding the ground for automotive RISC-V appeared first on Electronics Weekly.

Chips Act a “horrible, horrible thing”, says Trump

March 6, 2025
david manners

The US Chips Act is under threat following President Trump’s speech to the US Congress when he called the Act a “horrible, horrible thing”. Trump asked Congress to get rid ...

The post Chips Act a “horrible, horrible thing”, says Trump appeared first on Electronics Weekly.

EnSilica to design ASIC for ESA

March 6, 2025
david manners

In partnership with the European Space Agency (ESA),  mixed-signal ASIC specialist EnSilica, will design and develop a key silicon component to enable multi-band GNSS capabilities. The ESA, NAVISP Element 2 ...

The post EnSilica to design ASIC for ESA appeared first on Electronics Weekly.

Q4 DRAM market grew 9.9%

March 6, 2025
david manners

The Q4 DRAM market grew 9.9% topping $28 billion driven by rising contract prices for server DDR5 and concentrated shipments of HBM, reports TrendForce. Seasonal Q1 weakness and weakening CSP ...

The post Q4 DRAM market grew 9.9% appeared first on Electronics Weekly.

Westcott Drone Test and Development Centre gets development update

March 6, 2025
Alun Williams

The Westcott Drone Test and Development Centre (DTDC) is benefiting from a major upgrade to its facilities. Funding of £1.4 million from Buckinghamshire Local Enterprise Partnership (LEP). The new upgrades ...

The post Westcott Drone Test and Development Centre gets development update appeared first on Electronics Weekly.

Embedded World: COM-HPC Mini modules with Intel Gen 13 Core H, P or U

March 5, 2025
steve bush

Tria Technologies is launching COM-HPC Mini computer modules at Embedded World next week. At there heart are Intel 13th generation Core H, P or U series processors, enabling “system designers ...

The post Embedded World: COM-HPC Mini modules with Intel Gen 13 Core H, P or U appeared first on Electronics Weekly.

Embedded World: Click board offers LTE-M and NB-IoT comms

March 5, 2025
steve bush

Mikroe has introduced a dual-mode LTE-M and NB-IoT tranceiver in its ‘Click’ board circuit prototyping format. Called ‘LTE IoT 10 Click’, it is built around Sequans’ Monarch GM02S IC, which ...

The post Embedded World: Click board offers LTE-M and NB-IoT comms appeared first on Electronics Weekly.

Grid-scale Na-ion battery company raises €8m

March 5, 2025
steve bush

Moonwatt has raised €8m towards developing sodium-ion batteries for storing solar-generated power over night. The round was lead by Daphni and LEA Partners, and included Founders Future, AFI Ventures and ...

The post Grid-scale Na-ion battery company raises €8m appeared first on Electronics Weekly.

Bluetooth and Zigbee MCU, with SESIP3 and PSA Level3 security

March 5, 2025
steve bush

ST is aiming at secured Bluetooth, Zigbee and other 2.4GHz comms with a wireless MCU family. Called STM32WBA6x, the controllers have a 100MHz Arm Cortex-M33 core with floating-point and DSP ...

The post Bluetooth and Zigbee MCU, with SESIP3 and PSA Level3 security appeared first on Electronics Weekly.

Indie Semi to use GloFo 22nm FD-SOI process for radar SoCs

March 5, 2025
david manners

indie Semiconductor, the automotive SiPho and sensor specialist,  is to use Globalfoundries’ 22nm FD-SOI process for its 77GHz and 120GHz radar SoCs for ADAS and industrial applications. .Automotive radar adoption ...

The post Indie Semi to use GloFo 22nm FD-SOI process for radar SoCs appeared first on Electronics Weekly.

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