JEDEC and OCP (Open Compute Project Foundation) announce new Chiplet Design Kits for EDA use covering four areas: Assembly, Substrate, Material and Test. Basically, they are a way for chiplet ...
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MAGDEBURG, Germany—Engineers at the Fraunhofer Institute for Factory Operation and Automation here are developing an automated process for electronics recycling..
Gilmour Space Technologies has cleared the last regulatory hurdle before an Australian launch, receiving final airspace approvals from the country’s Civil Aviation Safety Authority (CASA) and Airservices Australia. The Australian ...
The post Gilmour Space’s Australian orbital rocket launch clears last hurdle appeared first on Electronics Weekly.
Lip-Bu Tan (pictured) is to be the CEO of Intel from March 18th The former board member resigned last August citing frustrations with a ‘bloated’ workforce, a ‘risk-averse culture’ and ...
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ASML and imec have signed a new strategic partnership agreement, focusing on research and sustainability. The agreement has a duration of five years and aims to deliver valuable solutions in ...
The post Imec and ASML sign five year R&D agreement appeared first on Electronics Weekly.
Insight SIP, the specialist in ultra-miniature RF modules, is launching the ISP2554-HM module. This module represents a dynamic IOT node, with support for Bluetooth Low Energy, Thread, and Zigbee radios ...
The post Highly integrated dynamic IoT node in 9x9x1mm package appeared first on Electronics Weekly.
What role could emerging cooling technologies play in making li-ion batteries more efficient? ask two specialists at Withers & Rogers. As lithium-ion batteries become smaller and therefore more power-dense, to ...
The post Viewpoint: Could novel cooling technologies unlock the hidden potential of domestic batteries? appeared first on Electronics Weekly.
Pushing back against ever hotter computer-on-modules, Congatec is offering heat-pipe based heatsinking, using acetone as a working fluid to accommodate sub-0°C switch-ons – operation is over -40 to +85°C. The ...
The post Embedded World: Heatpipe cooling for COM-HPC computer modules appeared first on Electronics Weekly.
Red Pitaya has upgraded its Stemlab 125-14 four-channel 60Mz software-defined test instrument. “This next-generation series enhances performance and reliability while maintaining backward compatibility,” according to the company. “With improved features ...
The post Embedded World: 60MHz 125sample/s software-defined scope and sig-gen appeared first on Electronics Weekly.
Texas Instruments is claiming “the world’s smallest” for its latest MCU, which measures 1.6 x 0.86mm (1.38mm2) in its 8pad DSBGA package. Despite this, it has a 24MHz 32bit Arm ...
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