Alphawave Semi claims to have delivered the first 3nm successful silicon bring-up of UCIe Die-to-Die (D2D) IP with TSMC’s CoWoS advanced packaging technology. The complete PHY and Controller subsystem was ...
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RAAAM Memory Technologies, a three year-old Israeli memory startup, has been awarded €5.25 million from the European Investment Council (EIC) to pursue an embedded memory technology it calls Gain-Cell RAM ...
The post RAAAM awarded €5.5m by EIC to develop SRAM alternative appeared first on Electronics Weekly.
The advanced packaging (AP) market is expected to have a CAGR23-29 of 11% to reach $69.5 billion in 2029, says Yole Group. The AP supply chain is undergoing significant transformation, ...
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A team from KIOXIA, the inventor of NAND flash memory, is the recipient of the FMS: the Future of Memory and Storage Lifetime Achievement Award for 2024. The KIOXIA engineering ...
The post Kioxia 3D NAND team win lifetime achievement award appeared first on Electronics Weekly.
UK scientists and engineers have successfully fired a high powered laser energy weapon from a British Army combat vehicle for the first time. The ground-breaking test was conducted at Dstl’s ...
The post First trial on British Army vehicle for high-powered laser weapon appeared first on Electronics Weekly.
Forget exploiting carbon nanotubes electrochemically, and just wind them up like clockwork if you want to store energy. This is not quite the message that researchers at the University of ...
The post Modern twist on clockwork stores more energy appeared first on Electronics Weekly.
Distributor Avnet has introduced the Tria brand for its embedded computing products (computer on modules, boards and systems). It has also announced the Tria Technologies business group which will also ...
The post Avnet groups embedded computing under Tria Technologies brand appeared first on Electronics Weekly.
The increased complexity of semiconductor designs that need validating is a problem for simulators, says Pradeep Thiagarajan, principal product manager for custom IC verification, introducing Siemens’ Solido Simulation Suite software ...
The post Siemens adds AI to simulation tools appeared first on Electronics Weekly.
Three bench oscilloscopes by Siglent, the SDS800X HD, SDS1000X HD and SDS3000X HD are now available from Telonic Instruments. The high-resolution oscilloscopes address signal fidelity, visualisation, and analysis with 12-bit ...
The post Telonic adds Siglent’s 12-bit oscilloscopes appeared first on Electronics Weekly.
The success of EVs in China has given its auto insurers a headache – they’re making a loss on EV insurance but are debarred by law from putting up premiums. ...
The post China’s suffering EV insurers appeared first on Electronics Weekly.
