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Teledyne e2v hooks up with Starris Optima on cameras for small satellites

July 31, 2024
david manners

Teledyne e2v Space Imaging is collaborating with Starris Optima Space Systems to develop space cameras for small satellites and lunar ecosystems. “Our joint development of these compact camera payloads begins ...

The post Teledyne e2v hooks up with Starris Optima on cameras for small satellites appeared first on Electronics Weekly.

Binder eyes miniaturisation for M8 12-pin circular connector

July 31, 2024
Alun Williams

Binder is adding an M8 12-pin circular connector to its industrial portfolio. Featuring 12 pins on the compact M8 connector face, the connectors are aimed at projects requiring miniaturisation. Applications ...

The post Binder eyes miniaturisation for M8 12-pin circular connector appeared first on Electronics Weekly.

Molex and Infineon hook up on coreless sensors

July 31, 2024
david manners

 Molex has  brought out its Percept Current Sensors to provide busbar current sensors in industrial and automotive applications. The sensors combine Infineon’s coreless current sensors and Molex’s electronics packaging to  reduce ...

The post Molex and Infineon hook up on coreless sensors appeared first on Electronics Weekly.

CUI gets into tweeters

July 30, 2024
steve bush

CUI Devices has added tweeters to its range of loudspeakers. Called the CTW range, there are six tweeters, measuring from 30.5 x 30.5mm to 58.8 x 58.8 mm, and between ...

The post CUI gets into tweeters appeared first on Electronics Weekly.

32bit dsPIC DSP-enabled MCUs from Microchip

July 30, 2024
steve bush

Microchip Technology has announced a 32bit 200MHz version of its dsPIC33 series of DSP-heavy MCUs. dsPIC33A, as the family will be called, is aimed at fast closed-loop control of PSUs ...

The post 32bit dsPIC DSP-enabled MCUs from Microchip appeared first on Electronics Weekly.

Alphawave Semi first to 3nm UCIe D2D IP silicon bring-up

July 30, 2024
david manners

Alphawave Semi claims to have delivered the first 3nm successful silicon bring-up of  UCIe Die-to-Die (D2D) IP with TSMC’s CoWoS advanced packaging technology. The complete PHY and Controller subsystem was ...

The post Alphawave Semi first to 3nm UCIe D2D IP silicon bring-up appeared first on Electronics Weekly.

RAAAM awarded €5.5m by EIC to develop SRAM alternative

July 30, 2024
david manners

RAAAM Memory Technologies, a three year-old Israeli memory startup, has been awarded €5.25 million from the European Investment Council (EIC) to pursue an embedded memory technology it calls Gain-Cell RAM ...

The post RAAAM awarded €5.5m by EIC to develop SRAM alternative appeared first on Electronics Weekly.

Advanced Packaging market growing at 11% CAGR 23-29 to $69.5bn

July 30, 2024
david manners

The advanced packaging (AP)  market is expected to have a CAGR23-29 of 11% to reach $69.5 billion in 2029, says Yole Group. The AP supply chain is undergoing significant transformation, ...

The post Advanced Packaging market growing at 11% CAGR 23-29 to $69.5bn appeared first on Electronics Weekly.

Kioxia 3D NAND team win lifetime achievement award

July 30, 2024
david manners

A team from KIOXIA, the inventor of NAND flash memory, is the recipient of the FMS: the Future of Memory and Storage Lifetime Achievement Award for 2024. The KIOXIA engineering ...

The post Kioxia 3D NAND team win lifetime achievement award appeared first on Electronics Weekly.

First trial on British Army vehicle for high-powered laser weapon

July 30, 2024
Alun Williams

UK scientists and engineers have successfully fired a high powered laser energy weapon from a British Army combat vehicle for the first time. The ground-breaking test was conducted at Dstl’s ...

The post First trial on British Army vehicle for high-powered laser weapon appeared first on Electronics Weekly.

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