L up and R down in 0402 inductors

 Coilcraft 0402DFThe 0402DF series of chip inductors offers higher inductance and significantly lower resistance compared with previous 0402-sized inductors, claims maker Coilcraft.

There are 25 values from 20nH to 3.3µH (+/- 5%).

As an example of resistance, the 220nH value is 240mΩ – 55% lower than the same value in Coilcraft’s 0402AF sSeries “making it optimised for use as a harmonic filter element for NFC applications”, said the firm.

Other proposed applications are as elements in band-stop filters, low-pass filters, one-pole filters, an RF choke in cellular bands, or for ground-to-ground isolation.

The cores are ferrite, and terminations are RoHS 6/6-compliant matte tin over nickel over silver-palladium-glass frit.

 

steve bush

Zynq UltraScale+ gets Micrium RTOS for all processors

1423770108534Xilinx’s All Programmable Zynq UltraScale+ MPSoC has been supported by a commercial real-time operating system (RTOS) from Micrium.

The Zynq UltraScale+’s quad-core ARM Cortex A53 and dual-core Cortex R5 CPUs will run the Micrium µC/OS-II, µC/OS-III kernels and full suite of RTOS components, the company says.

They will also run on the Xilinx MicroBlaze FPGA-based soft processor core which can be part of a Zynq design.

Satish Swarnkar, senior director of software product management at Xilinx writes:

“The Zynq Ultrascale+ has an ARM processor and supports FPGA-based MicroBlaze soft processors. Micrium is highly scalable RTOS that can be used in the ARM and our MicroBlaze processors, simplifying application design by giving end users the capability to use a single operating system.”

The Xilinx SDK support includes µC/OS-II and µC/OS-III and components, including µC/TCP-IP, µC/USB, µC/FS, (among others), for the Zynq Ultrascale+ which can be downloaded from the Micrium website.

Along with the Cortex-A53  and Cortex-R5 CPUs, Zynq UltraScale+ MPSoC has an ARM Mali-400 graphics processor.

 

Richard Wilson

Zynq UltraScale+ gets Micrium RTOS for all processors

1423770108534Xilinx’s All Programmable Zynq UltraScale+ MPSoC has been supported by a commercial real-time operating system (RTOS) from Micrium.

The Zynq UltraScale+’s quad-core ARM Cortex A53 and dual-core Cortex R5 CPUs will run the Micrium µC/OS-II, µC/OS-III kernels and full suite of RTOS components, the company says.

They will also run on the Xilinx MicroBlaze FPGA-based soft processor core which can be part of a Zynq design.

Satish Swarnkar, senior director of software product management at Xilinx writes:

“The Zynq Ultrascale+ has an ARM processor and supports FPGA-based MicroBlaze soft processors. Micrium is highly scalable RTOS that can be used in the ARM and our MicroBlaze processors, simplifying application design by giving end users the capability to use a single operating system.”

The Xilinx SDK support includes µC/OS-II and µC/OS-III and components, including µC/TCP-IP, µC/USB, µC/FS, (among others), for the Zynq Ultrascale+ which can be downloaded from the Micrium website.

Along with the Cortex-A53  and Cortex-R5 CPUs, Zynq UltraScale+ MPSoC has an ARM Mali-400 graphics processor.

 

Richard Wilson

China semiconductor sales worth $12.5bn last year – CSIA

TI China fabChina’s semiconductor industry value chain was worth $48 billion last year, according to the China Semiconductor Industry Association (CSIA) but is largely contributed by foreign companies.

The output value of the China semiconductor industry was $12.5bn in 2014, of which $5bn came from IC design, $3.7bn from fabrication, and $3.8bn from packaging and testing.

80% of the wafers produced in China came from TSMC, says the CSIA.

The China government is investing heavily to create an indigenous memory industry, says the CSIA, because China is the largest memory market and buys 75% of global memory production.

See more China stories on Electronics Weekly »

david manners

China semiconductor sales worth $12.5bn last year – CSIA

TI China fabChina’s semiconductor industry value chain was worth $48 billion last year, according to the China Semiconductor Industry Association (CSIA) but is largely contributed by foreign companies.

The output value of the China semiconductor industry was $12.5bn in 2014, of which $5bn came from IC design, $3.7bn from fabrication, and $3.8bn from packaging and testing.

80% of the wafers produced in China came from TSMC, says the CSIA.

The China government is investing heavily to create an indigenous memory industry, says the CSIA, because China is the largest memory market and buys 75% of global memory production.

See more China stories on Electronics Weekly »

david manners

Semefab sees improving margins

Semefab Glenrothes

Semefab Glenrothes

Semefab, the Glenrothes CMOS sensor specialist, has said it expects margins to recover this year after making a loss of £582,930 in 2014 on sales that increased 15% to £9.06 million. In 2013 it made a profit of £127,065.

Semefab attributed the losses to circumstances outside its control:

  • Extra staff taken on to cope with a rise in orders were not fully productive.
  • There were unexpected rises in costs particularly energy cost.
  • Investment in work in progress did not convert to revenue due to unforeseen events.
  • The plant was shut down for two weeks to comply with a three yearly mandatory Fixed Wiring and Electrical Inspection.

Semefab is working with Swansea University and a commercial partner to develop a generic platform point-of-care diagnostic sensor.

The company had net current assets and shareholders’ funds of £1,189,619 and £4,051,401 respectively at the end of 2014.

david manners

Inphi delivering 40/50/100/400G PAM4 interconnect ICs

Siddarth Sheth - Vice President, Networking Interconnect

Siddarth Sheth – Vice President, Networking Interconnect

High speed analogue semiconductor company Inphi will have general availability in Q4 of four-level pulse amplitude modulation (PAM4) chipset solutions for 40G, 50G, 100G, 400G and a companion linear TIA for multi-rate PAM4 interconnects, it says.

The foundation of the PAM4 PHY IC solutions is InphiNity Core DSP Engine and a media agnostic dual mode OmniConnecttransmitter architecture that can be targeted to multiple performance oriented applications for optical and copper based interconnects, while keeping a low power profile.

There is a clear need to increase the speed of interconnect pipes while maintaining cloud economics and lowering carbon footprints, says Inphi. PAM4 modulation will take the industry over the next wave of Ethernet deployments for optical and copper interconnects by doubling the bits-per-symbol at the same baud rate, it says.

By integrating multiple channels along with transmit and receive PAM4 and FEC functions on a single IC, Inphi claims it can double the levels of integration available from existing PAM4 IC offerings and scale the solution across multiple rates.

“With multiple contributions on PAM4 technology in the IEEE and other industry MSAs and with the IEEE 400Gbps taskforce agreeing to use PAM4 for next- generation electrical and optical interfaces, Inphi has now proven that not only does the technology work, but can be productized and is indeed the right way forward to 40G, 50G, 100G, 400G and beyond,” says Inphi’s Siddarth Sheth.

david manners

Arduino-compatible IoT platform comes with apps and cloud service

1x-XBee-S1-300x300An Arduino-compatible coding platform has been designed by Digi International for building M2M wireless sensors and other IoT networks.

Available exclusively through Digi-Key for $99, the XBee platform comes with an API to design M2M wireless communications, in the 2.4GHz unlicensed frequency band, into control systems and sensor networks.

The coding platform features an Arduino-compatible microprocessor, three XBee modules, LEDs, adapters, cables, and other components in addition to software code examples.

Five design projects use the Processing open source programming language for development.

The distributor has set-up a separate support website for XBee.

 “The XBee brand by Digi International is well known in wireless circles for delivering innovation at an appealing price point,” said David Stein, vice-president of global semiconductors at Digi-Key.

XBee wireless networking applications can also make use of a device cloud service provided by Digi for secure management of multiple devices.

Richard Wilson

Graphene and boron nitride make a semiconductor junction

graphene BN Yoke Khin Yap MitchiganGraphene and boron nitride nanotubes can form a digital switch, according to Michigan Technological University.

Respectively they are a zero band-gap conductor and wide band-gap insulator.

“When we put them together, you form a band gap mis-match that creates a potential barrier that stops electrons,”said Michigan professor Yoke Khin Yap.

The team took exfoliated graphene and grew BN tubes on it with chemical vapour deposition (see diagram): 60nm diameter hetrojunctions formed at the joins.

Tungsten scanning tunnelling microscope (STM) probes were used to contact the graphene and the tube.

When the probe was 1.23µm up the tube from the join there was no conduction (±30V bias).

At 620nm away from the join, a symmetrically-conducting junction formed – with a curve much like a diode conduction curve, but bidirectional, which was conducting significantly (0.5µA) with 30V bias in either duirection.

graphene BN Yoke Khin Yap MitchiganShifting the distance to 100nm caused the junction to conduct significantly by ~12V.

Attempts to turn the junction into a transistor  – the under-lying oxidised silicon wafer (500nm oxide) was used as a back-gate – were unsuccessful, even at ±100V. The team proposed that highly-conductive lower layers of the multi-layer graphene shielded the junction, and that a top-gated structure might work.

Simulation by density functional theory (DFT) suggests that mismatch of the density of states (DOS) is responsible for the voltage-dependant  switching behaviour, according to ‘Switching behaviors of graphene boron nitride nanotube heterojunctions‘, a paper covering the work in Nature Scientific Reports.

steve bush

NIWeek: PXI brings fast parallel test to 4G

wts_05_bdrNI is aiming to make wireless manufacturing test more cost-effective as system move to volume production.

The key is to run test in parallel to improve throughput.

To do this the company has introduced at NIWeek in Austin, Texas today, a multi-standard, multi- DUT and multi-port test system based on the PXI modular instrument platform.

The Wireless Test System (WTS) uses software-designed PXI vector signal transceiver hardware running LabVIEW and TestStand sequencing software.

The scalable RF test platform supports a range of wireless standards including LTE Advanced, 802.11ac Wi-Fi and Bluetooth Low Energy.

It can be used to test multi-standard 3G and 4G hardware which now also incorporates additional short-range wireless connectivity and navigation standards.

Richard Wilson