5G will need a radio technology change

Research is indicating there will be a completely new radio technology for the 5G mobile communications standard expected to hit the market by 2020.

MiWaveS 5G network concept

MiWaveS 5G network concept

Research work in the UK and across Europe into the next generation mobile phone standard is now focusing on the use of millimetre wave radio transmission at very high 30-300GHz frequencies.

If implemented, this will represent the biggest technology change for a mobile generation since the switch from analogue to digital GSM technology more than a decade ago.

For researchers in the UK, France and Germany everything is up for grabs. The standards work for the radio access network (RAN) has yet to begin.

The first discussions on potential global standards will start next month at a 3GPP standards meeting in Arizona.

According to Professor Rahim Tafazolli, director of the 5G Innovation Centre (5GIC) at the University of Surrey:

“Global 5G research is still taking place in isolation, but this will change. Various groups have different technology favourites, and the 3GPP standardisation discussions will start in September. I expect technology selection will start in 2016.”

The use of the millimetre wave frequency band, which is 30-300GHz, has benefits of spectrum efficiency, the use of lower power radio cells and data capacity, but will have significant implications for chipset makers.

In particular, the general switch from CMOS to gallium arsenide and gallium nitride process technologies.

The other reason for the radical jump in frequency is the lack of sufficient spectrum below 6GHz, which leads to high interference levels.

According to Dr. Laurent Dussopt from CEA-Leti and manager of the European Commission-funded MiWaveS project, the use of the millimetre wave frequency bands at 60GHz and 71-86GHz will enable data transmissions up to 10Gbit/s for backhaul and 5Gbit/s for mobile user access.

However, Dussopt believes this will be a challenge for the system architecture, networking functions and algorithms, radio and antenna technologies.

Millimetre wave radios use much higher carrier frequencies than 4G or Wi-Fi, allowing higher data rates, which could be as much as 50 times faster than 2.4GHz Wi-Fi. And at 60GHz there is significantly more unallocated spectrum.

According to researchers at The University of Bristol, which is also working on millimetre wave technology, the challenge at 60GHz is how to overcome the additional signal losses. If transmit powers and antenna gains were equal, at 60GHz the received signal would be 1000x weaker than a Wi-Fi signal.

Nokia’s Networks division is working with National Instruments to demonstrate the viability of high-frequency millimetre wave transmission for 5G.

“Our experimental 5G Proof-of-Concept system will be implemented using NI’s LabVIEW and PXI baseband modules, which is the state-of-art experimental system for rapid prototyping of 5G air interface available today,” said Lauri Oksanen, vice-president of research and technology at Nokia.

Aspects of the next generation mobile communications technology the companies are researching are peak data rates and cell-edge rates in excess of 10Gbit/s and 100Mbit/s, respectively.

Work in the European MiWaveS project is intended to demonstrate how low-cost or advanced millimetre wave technologies can provide multiGigabits per second access to mobile users and contribute to sustain the traffic growth.

It believes the exploitation of the available millimetre wave spectrum will be a key element in building high-throughput and low latency infrastructures for next generation heterogeneous mobile networks.

The UK’s main 5G research centre, the 5GIC at the University of Surrey is to be part of the MiWave S project.

Other project members include: CEA-Leti, Orange, Nokia, Intel, National Instruments Dresden and STMicroelectronics.

Richard Wilson

5G will need a radio technology change

Research is indicating there will be a completely new radio technology for the 5G mobile communications standard expected to hit the market by 2020.

MiWaveS 5G network concept

MiWaveS 5G network concept

Research work in the UK and across Europe into the next generation mobile phone standard is now focusing on the use of millimetre wave radio transmission at very high 30-300GHz frequencies.

If implemented, this will represent the biggest technology change for a mobile generation since the switch from analogue to digital GSM technology more than a decade ago.

For researchers in the UK, France and Germany everything is up for grabs. The standards work for the radio access network (RAN) has yet to begin.

The first discussions on potential global standards will start next month at a 3GPP standards meeting in Arizona.

According to Professor Rahim Tafazolli, director of the 5G Innovation Centre (5GIC) at the University of Surrey:

“Global 5G research is still taking place in isolation, but this will change. Various groups have different technology favourites, and the 3GPP standardisation discussions will start in September. I expect technology selection will start in 2016.”

The use of the millimetre wave frequency band, which is 30-300GHz, has benefits of spectrum efficiency, the use of lower power radio cells and data capacity, but will have significant implications for chipset makers.

In particular, the general switch from CMOS to gallium arsenide and gallium nitride process technologies.

The other reason for the radical jump in frequency is the lack of sufficient spectrum below 6GHz, which leads to high interference levels.

According to Dr. Laurent Dussopt from CEA-Leti and manager of the European Commission-funded MiWaveS project, the use of the millimetre wave frequency bands at 60GHz and 71-86GHz will enable data transmissions up to 10Gbit/s for backhaul and 5Gbit/s for mobile user access.

However, Dussopt believes this will be a challenge for the system architecture, networking functions and algorithms, radio and antenna technologies.

Millimetre wave radios use much higher carrier frequencies than 4G or Wi-Fi, allowing higher data rates, which could be as much as 50 times faster than 2.4GHz Wi-Fi. And at 60GHz there is significantly more unallocated spectrum.

According to researchers at The University of Bristol, which is also working on millimetre wave technology, the challenge at 60GHz is how to overcome the additional signal losses. If transmit powers and antenna gains were equal, at 60GHz the received signal would be 1000x weaker than a Wi-Fi signal.

Nokia’s Networks division is working with National Instruments to demonstrate the viability of high-frequency millimetre wave transmission for 5G.

“Our experimental 5G Proof-of-Concept system will be implemented using NI’s LabVIEW and PXI baseband modules, which is the state-of-art experimental system for rapid prototyping of 5G air interface available today,” said Lauri Oksanen, vice-president of research and technology at Nokia.

Aspects of the next generation mobile communications technology the companies are researching are peak data rates and cell-edge rates in excess of 10Gbit/s and 100Mbit/s, respectively.

Work in the European MiWaveS project is intended to demonstrate how low-cost or advanced millimetre wave technologies can provide multiGigabits per second access to mobile users and contribute to sustain the traffic growth.

It believes the exploitation of the available millimetre wave spectrum will be a key element in building high-throughput and low latency infrastructures for next generation heterogeneous mobile networks.

The UK’s main 5G research centre, the 5GIC at the University of Surrey is to be part of the MiWave S project.

Other project members include: CEA-Leti, Orange, Nokia, Intel, National Instruments Dresden and STMicroelectronics.

Richard Wilson

UK quantum computing start up gets first round funding

Grupo Arcano has invested in Cambridge Quantum Computing (CQCL). Although undisclosed, the amount has been reported to be $50m by Tech City News.

Established in early 2013 CQCL was founded to create tools and algorithms for the commercialisation of quantum computers. It has an operating system called ‘ t|ket> ‘ and is focusing on field including: cryptography, financial services,  medicine, biotech, and big data.

Grupo Arcano has invested in Cambridge Quantum Computing (CQCL)

Grupo Arcano has invested in Cambridge Quantum Computing (CQCL)

“After just over two years of being self-funded, the technology investing company Grupo Arcano invested in and has become an important shareholder of CQCL. The amount of the investment and the percentage ownership owned by Grupo Arcano is confidential and is not disclosed,” said CQCL.

“The funding allows CQCL to accelerate and build on its position as the world’s leading independent Quantum Computing company with a focus on developing a Quantum Operating System including a platform for developing a quantum processor, and on related algorithms and software.”

CQCL has posted some technical information about quantum computing.

 

steve bush

Murata power supply provides 12Vdc output at 1,200W

Murata has announced DC-input front end power supply modules with a 1,000VRMS isolated power supply providing a 12Vdc output at 1,200W with a standby voltage at up to 20W.

Murata's DC-input front end power supply

Murata’s DC-input front end power supply

With a power density of 28W per cubic inch, 54.5mm (2.15-inch) width and 1U height, it is suitable for 1U and 2U applications in servers, storage equipment, data centers, and telecommunications network equipment, says the company.

D1U54-D-1200 series DC-input models accommodate an operating input voltage range of -40Vdc to -72Vdc. This product series complements the AC-input D1U54P-W-1200 models and allows plug-and-play compatibility between products.

The hot-swap-enabled D1U54-D-1200 series has integral mosfet ORing in conjunction with active current sharing of the main output. These features allow up to eight units to operate in parallel, providing the capability to drive larger loads or to build in N+N redundancy of supplies.

With a PMBus compliant digital interface, the supply can be monitored, managed and controlled using industry standard PMBus protocol commands. Safety features of the new series include over-voltage, over-current and over-temperature protection.

Model selection includes choice of 3.3Vdc or 5.0Vdc standby outputs as well as forward or reverse airflow.

david manners

Position sensing is all about seeing black

Light-based proximity sensors for use in robots and 3D printers must not be fooled by transparent or black surfaces, says Gabriele Fulco

Figure 1: Reflective microsensor

Figure 1: Reflective microsensor

A surprising number of systems depend on the ability to accurately locate and identify physical objects. Robots need not only to detect obstacles, but also to identify the type of floor they are on, and to be aware of steps before they fall off them.

3D printers and IP cameras each present a whole new set of challenges. Vending machines need to handle a growing number of different types of packaging, including transparent glass and plastics.

The role of sensors

Light-based proximity sensors, alternatively known as photo‑microsensors (Figure 1), slotted switches, opto-switches or optical switches and photo interrupters, are generally used to detect the presence or absence of objects, to measure the speed and direction of rotating objects and in other applications.

Infra-red and visible LEDs have rated lifespans of over 100,000 hours, giving opto-switches an effectively infinite operational life. They can switch in four microseconds and operate at high frequency of up to 3,000 counts per second.

These characteristics make transmissive and reflective photo microsensors deservedly popular in office equipment, industrial automation systems, vending machines and home and building automation.

Figure 2: Transmissive slotted photo-interrupter

Figure 2: Transmissive slotted photo-interrupter

Of the newer applications, 3D printers require detection of the position of the print head, and confirmation of correct feeding and movement of the filament; IP cameras need to detect the angle and position of the camera body; and there are countless requirements to detect position in fitness and massaging machines.

Established styles don’t necessarily fully address these new applications. Although they detect most surface textures and colours, they don’t easily detect transparent objects and can be fooled by black items too.

Many have a ‘slotted’ style where the size of the object detected is limited by the width of the slot (Figure 2). They do have a long sensing distance, which can be good, but can also be a drawback as spurious detections can result from objects moving into the background.

New approaches

New technologies are emerging which not only benefit the newer designs, but have advantages for developers of the more established applications too.

Figure 3: Light convergent reflective sensor

Figure 3: Light convergent reflective sensor

Light convergent reflective sensors (Figure 3) detect only objects that are a specific distance from the sensor. They can eliminate background and can detect both specular and diffuse reflecting objects reliably, regardless of their colour or material. They were originally developed for robot cleaning units, which needed to detect and reliably clean floors made of all kinds of materials in any colour.

Particular challenges for traditional optical sensors were detecting floors with glass or black areas. Traditional sensors also struggled to identify downward steps.

Using the new light convergent technology, robot cleaners can be reliably programmed to turn away from ‘cliffs’ and can accurately identify all kinds of floor coverings, implementing the most appropriate cleaning approach for each one.

The same technology is now also being widely applied in printers, allowing them to detect a much wider range of materials including black paper and clear film. Similarly, vending machines can now detect transparent cups, eliminating the need to fit a label to clear glass or plastic items to ensure that they are detected.

Checking the distance

Also new is the introduction of micro displacement sensors. These calculate the distance of the detected object, producing an output voltage proportional to the distance.

Typical devices can detect displacements with a resolution of 10 microns at a distance range of 6.5mm ±1.0mm. They are accurate enough, for example, to detect a double feed in a copier, count the notes in a cash dispenser and detect the amount of paper remaining on a till roll in a mini printer or point-of-sale system.

The first proximity switches were introduced in 1960, and LED type photo electric sensors in the early 1970s.

Although the core principle of pairing an LED light source with a detector remains the same, switches have increased considerably in sophistication and accuracy since then. Light-based proximity sensors continue to develop and it is inevitable that robotics and 3D visualisation will drive further improvements in this technology.

Gabriele Fulco is European product marketing manager for sensors at Omron Electronic Components

Richard Wilson

Military upgrades march in step with modular design

Anthony Green describes the processes a manufacturer needs to implement to ensure mil-spec reliability for electronic control circuits.

Military upgrades march in step with modular design

Military upgrades march in step with modular design

The pace of development of electronics in the military and aerospace market brings its own challenges for the manufacturer when undertaking major upgrades to legacy products that already meet regulatory standards.

This case study describes a defence electronics firm with a strength in airborne mission-critical systems, that required two separate electronic control modules for a new AESA radar system to be developed and manufactured.

The main control interface would enable communication with the aircraft’s pilot‑controlled electronics. The front‑end controller module was to emit electrical timing reference signals and manage the clock distribution for the antenna system within the radar. Both were part of an upgrade that would replace an older, more mechanical radar system that was proving unreliable.

Reliability

The customer had designated design for reliability as a top priority. The modules had to be suitable for use in military jet fighters where space and weight is a major consideration; to be able to cope with extremes of temperature, vibration and sudden shock from gunfire; and they had to be compact, lightweight, and electromagnetically shielded to minimise noise amid radar signals.

Once integrated into the avionics of the plane, the boards would deliver high-resolution radar at medium and long range. To achieve the maximum reliability possible the manufacturing design team reviewed and introduced a range of techniques that included careful selection of components and consideration of thermal expansion properties and tin whisker growth.

Careful PCB layout in relation to adjacent metal materials and the addition of conformal coating further mitigated the risk of tin whisker growth.

The design was developed to meet the de-rating guidelines submitted by the customer and the component specifications for voltage, power, frequency and thermal properties. Lightweight, reliable thermal relief techniques were employed that included selective conduction cooling to a cool wall. Potential hot spots were identified by thermal analysis, which lead to revisions to the PCB layout.

Standards

After an assessment of the mean time between failures (MTBF) the team made sure the product would reach the military standard MIL-HDBK-217B. Putting the antennas through failure mode and effects analysis (FMEA) defined which areas were potential reliability risks and lead to a re-design of the protective circuits to defend against threats such as lightning strikes.

By using signal integrity optimisation of critical high-speed signals and then slowing edges of certain signals, the team reduced the potential noise in the radar antenna, which improved reliability of the critical reference clock distribution.

Moving from the design stage, the modules were then manufactured to an IPC Class 3 standard using a tin-lead solder process; conformal coating; edge sealing and corner bonding of ball grid arrays (BGAs); and re-balling and hot solder dipping of components for tin whisker growth mitigation.
The final stage of the process was environmental stress screening, which was carried out by the customer before the modules were moved into inflight trialling. Both the electronic control modules are now in operation.

The manufacturing design team had to work closely with customers and, at times, stray from the script in commoditising the product. They had to look at how the legacy products had worked and re-configure the design to meet 21stC military certification, while looking to the potential for future upgrade of the components, including producing accurate documentation at every stage in the development and production process. Compliance with all regulations had to be achievable and all documentation has to tell a coherent story of equipment’s development and testing.

Co-operation between military and aerospace manufacturers and design engineers can bring products to market on time, on budget, with regulations met.

Anthony Green is director of engineering, EMEA at Plexus

Defence & Security Equipment International (DSEI) 2015 takes place at ExCeL, London, 15-18 September. The companies, systems suppliers and specialist electronics firms attending reflect the importance of electronics to military systems.

Alun Williams

Microwave pioneer gets Frank Whittle Medal

British microwave engineer Professor Peter Clarricoats is to receive the Sir Frank Whittle Medal, one of the Royal Academy of Engineering’s highest accolades.

Clarricoats, CBE FREng FRS, gets the Whittle Medal for influential achievements spanning more than half a century.

According to the Academy, these achievements include:

  • Research with Sir Charles Kao optical fibre technology – Kao got a Nobel prize for inventing optical fibres.
  • Influential work on the high-performance microwave antennas for satellite communications.
  • The first person in the UK to explore the behaviour of ferrites. “His book Microwave Ferrites became an essential text for those developing microwave radar and communications systems,” said the academy.
  • First to use computers to design microwave waveguide junctions (University of Leeds).
  • Establishment of the journal Electronic Letters.
  • A theory that confirmed the correct choice of physical attributes in optical fibre (Queen Mary University of London).
  • Microwave antennas for communication and radar systems. “Most ground station reflectors, radio astronomy reflectors and satellite antennas now use corrugated horns of the type first investigated by Professor Clarricoats in the 1970s and ’80s,” said the Academy.
  • Industrial and government appointments with institutions including the Ministry of Defence and the European Space Agency.

Any wisdom to pass on?

“My message to academics is to get involved with industry,” said Clarricoats, “Since I joined the academic world from industry in 1959, I have been able to start research groups at Queens University Belfast, the University of Leeds and finally at Queen Mary University of London where I have spent the last 47 years. In all three I was greatly helped by outstanding colleagues and from the outset was fortunate to have support from industry, government and the European Space Agency. We had great success in solving many of the problems they posed, often with innovative ideas.”

Academy President Professor Dame Ann Dowling will present the award to at the Academy’s AGM in London on 21 September.

steve bush

Buck converter draws only 180nA

Industry’s highest ultra-light-load power conversion efficiency, is Analog Devices’ claim for its latest buck converter – no load quiescent current through the ADP5301 is an impressive 180nA.

ADI ADP5301 buck converter

ADI ADP5301 buck converter

Depending on input and load, this can mean >90% efficiency across 5µA to 50mA output.

It also offers a novel way to select between multiple internally-set fixed output voltages (see table above) – Resistor Rvid is read at start-up and this value is used to select one of 16 internal voltage-setting feedback dividers. This keeps the super high (50Mohm, and therefore low-power) dividers on-die and safely away from humidity and dirt. There are actually two factory set voltage ranges: 1.2-3.6V (default), or 0.8-5.0V – see the data sheet for more.

Other factory options are: output discharge function disabled(default)/enabled and 350μs (default)/1.28ms soft-start.

Intended for IoT applications, input range is 2.15 to 6.5V, and once it is working this can drop to 2.0V.

Switching is at 2MHz, with external clock synchronisation from 1.2 to 2.5MHz.

The high efficiency and low quiescent figures above come from operating in hysteresis mode. For higher outputs (500mA), and less noise, at the expense of higher operating current, there is a selectable PWM mode.

There are actually four devices – the 5301, 00, 02 and 03 covering two options: 9ball WLCSP (<3.1mm²) or 10lead LFCSP, and Vout OK Flag or Vin OK flag.

“The buck regulator is designed to deliver maximum power for a longer period of time than previously achievable and is ideally suited for IoT applications, including wireless sensor networks and wearable devices such as fitness bands and smartwatches,” said ADI.

 

steve bush

Infineon adds logic level to StrongIRFETs

Infineon has extended its StrongIRFET Power MOSFET family with Logic Level StrongIRFETs which can be driven directly from a microcontroller.

Logic_Level_StrongIRFET_application.jpg_1287006039

Infineon adds logic level to StrongIRFETs

With the logic level extension, Infineon meets the market’s demand for StrongIRFETs that do not require a stand-alone driver.

In the logic level variant the necessary gate-source voltage is reduced to 4.5 V. This makes it possible to directly connect the MOSFET with the microcontroller in many applications.

“The Logic Level StrongIRFETs deliver two decisive advantages. They reduce the complexity of the electronic design in various applications and show an unmatched ruggedness,” says Infineon’s Stéphane Ernoux.

The characteristic performance features of the StrongIRFET family have been retained in the logic level extension: Low on-state resistance (0.52 mΩ typ. and 0.97 mΩ max.) for reduced conduction losses, high current carrying capability for increased power capability and rugged silicon all make for high system reliability.

Production orders are available immediately.

david manners

TSMC exiting solar

TSMC exiting solar

TSMC exiting solar

TSMC is exiting solar by the end of the month.

Steve Tsu, chairman of TSM Solar, says the company couldn’t turn a profit with its solar manufacturing and that even the most aggressive cost-reduction plan wouldn’t make the solar subsidiary viable.

“TSMC continues to believe that solar power is an important source of green energy and that solar module manufacturing remains a robust and growing industry,” says Tsu. “But despite six years of hard work, we have not found a way to make a sustainable profit.”

The company will offer alternative jobs to employees working at its Taichung solar factory which is to close, said Tsu.

TSMC manufactured photovoltaic modules based on copper indium gallium diselenide (CIGS) material.

The company statement says:

TSMC Solar’s late entry to the market and lack of economies of scale led to a substantial cost disadvantage. After careful consideration, TSMC has come to the conclusion that despite its world-class conversion efficiency for CIGS technology, TSMC Solar will not be viable even with the most aggressive cost reduction plan.

TSMC estimates that charges related to closing the solar subsidiary’s fab will impact third quarter 2015 earnings per share by NT$0.07. Remaining solar panel inventory will be installed at TSMC buildings and facilities.

Read more TSMC stories on Electronics Weekly »

Read more Solar stories on Electronics Weekly »

david manners