Q2 bookings surge, reports SEMI

SEMI_Book to Bill_Chart_Jul2015A surge in bookings for semiconductor manufacturing equipment in Q2 meant that bookings exceeded billings in the quarter, reports SEMI, although there were some erratic local variations.

Billings were $9.4bn; bookings were $10.2bn.

Billings were 1% down on Q1 and 2% down on Q2 2014.

Bookings were 6% up on Q1 and 2% up on Q2 2014.

Taiwan’s Q2 billings of $2.34bn were 29% up on Q1 and 6% down on Q2 2014.

Korea’s Q2 billings of $2bn were 25% down on Q1 and 16% up on Q2 2014.

North America’s Q2 billings of $1.55bn were 5% up on Q1 and 33% down on Q2 2014

Japan’s Q2 billings of $1.4bn were 12% up on Q1 and 40% up on Q2 2014

China’s billings of $1.04bn were 10% down on Q1 and 1% up on Q2 2014.

Europe’s billings of $520m were 24% down on Q1 and 7% down on Q2 2014.

RoW billings of $530m were 24% up on Q1 and 7% up on Q2 2014.

david manners

Freescale buys image recognition firm CogniVue

As chip firms concentrate on the opportunity of autonomous vehicles, Freescale Semiconductor has acquired an Ottawa-based image cognition IP developer, CogniVue.

Automotive continues to be a key market for Freescale, which says it has shipped  more than 20 million units into ADAS applications to date, and has designs in 9 of the world’s top 10 automotive OEMs.

According to Bob Conrad, general manager of Freescale’s Automotive MCU group, said the image recognition IP would support its S32V234 vision processor.

“This acquisition places Freescale in a position to supply highly automated car applications with the requisite performance, safety, security and reliability those systems require,” said Conrad.

CogniVue vision processing IP has been available on the S32V processor since it was announced in March 2015, as well as other offerings.

 

 

Richard Wilson

Freescale buys image recognition firm CogniVue

As chip firms concentrate on the opportunity of autonomous vehicles, Freescale Semiconductor has acquired an Ottawa-based image cognition IP developer, CogniVue.

Automotive continues to be a key market for Freescale, which says it has shipped  more than 20 million units into ADAS applications to date, and has designs in 9 of the world’s top 10 automotive OEMs.

According to Bob Conrad, general manager of Freescale’s Automotive MCU group, said the image recognition IP would support its S32V234 vision processor.

“This acquisition places Freescale in a position to supply highly automated car applications with the requisite performance, safety, security and reliability those systems require,” said Conrad.

CogniVue vision processing IP has been available on the S32V processor since it was announced in March 2015, as well as other offerings.

 

 

Richard Wilson

US plan for 5G trials next year a good thing, says Bell Labs chief

Marcus Weldon, CTO Bell Labs, welcomes early 5G trials

Marcus Weldon, CTO Bell Labs, welcomes early 5G trials

The first field trials of a 5G mobile communications network could take place as early as 2016 in the US.

US operator Verizon is working with its hardware partners Alcatel-Lucent, Cisco, Ericsson, Nokia, Qualcomm and Samsung  to start 5G field trials in 2016.

Marcus Weldon, chief technology officer of Alcatel-Lucent and president of Bell Labs believes the plan for 5G trials next year is a good thing because even if 4G LTE technology still has “so much headroom left”.

It is possible bringing forward the 5G trials is a response by the US operator which my feel the US is falling behind Europe and Asia in the pace of development of 5G technologies.

As Rima Qureshi, chief strategy officer for Ericsson pointed out:

“A lot of development and requirements for 5G networks have so far come from Asian operators. It’s exciting to see a US company accelerate the rate of innovation and introduce new partners.”

The problem is that with 5G standards for the radio access network unlikely to be finalised by next year, any trial either in the US or Europe will be seen as an exploratory step along the way to commercial services which are at least five years away.

No operator is yet committing to 5G services before 2020 at the earliest.

Roger Gurnani, executive vice president and chief information and technology architect for Verizon said there is “a sense of urgency to push forward on 5G and mobilize the ecosystem by collaborating with industry leaders and developers.”

The trials, which will take place at Verizon’s testbeds in Waltham, Mass., and San Francisco, will test the 5G network’s capability to accommodate both wideband data services and narrowband connections to IoT devices. This will be one of the big challenges of 5G.

Another challenge will be defining the radio access network. Researchers in in Europe and Asia are considering using the radio spectrum at 60GHz, the so-called millimetre-wave band. This will provide the capacity needed for the anticipated 500MHz radio channels 5G will need.

Research is indicating there will be a completely new radio technology for the 5G mobile communications standard expected to hit the market by 2020.

Research work in Europe and China into the next generation mobile phone standard is now focusing on the use of millimetre wave radio transmission at very high 30-300GHz frequencies.

Japanese mobile operator NTT Docomo is working with US giants Intel and Qualcomm as part of its development of 5G research into mobile communications technologies.

Europe has the MiWaveS project which is intended to demonstrate how low-cost or advanced millimetre wave technologies can provide multi-gigabits per second access to mobile users and contribute to sustain the traffic growth.

It believes the exploitation of the available millimetre wave spectrum will be a key element in building high-throughput and low latency infrastructures for next generation heterogeneous mobile networks.

The UK’s main 5G research centre, the 5GIC at the University of Surrey is to be part of the MiWave S project.

Other project members include: CEA-Leti, Orange, Nokia, Intel, National Instruments Dresden and STMicroelectronics.

If implemented, this will represent the biggest technology change for a mobile generation since the switch from analogue to digital GSM technology more than a decade ago.

The standards work for the radio access network (RAN) only started this month at a 3GPP standards meeting in Arizona.

So what can we learn from the timing of 4G LTE trials. Verizon began testing 4G LTE as early as 2008 with the creation of a 10-cell network sandbox around Boston. This was two years before the launch of first commercial services.

By 2015, 87% of Verizon wireless data traffic is carried over the 4G LTE network.

 

 

Richard Wilson

US plan for 5G trials next year a good thing, says Bell Labs chief

Marcus Weldon, CTO Bell Labs, welcomes early 5G trials

Marcus Weldon, CTO Bell Labs, welcomes early 5G trials

The first field trials of a 5G mobile communications network could take place as early as 2016 in the US.

US operator Verizon is working with its hardware partners Alcatel-Lucent, Cisco, Ericsson, Nokia, Qualcomm and Samsung  to start 5G field trials in 2016.

Marcus Weldon, chief technology officer of Alcatel-Lucent and president of Bell Labs believes the plan for 5G trials next year is a good thing because even if 4G LTE technology still has “so much headroom left”.

It is possible bringing forward the 5G trials is a response by the US operator which my feel the US is falling behind Europe and Asia in the pace of development of 5G technologies.

As Rima Qureshi, chief strategy officer for Ericsson pointed out:

“A lot of development and requirements for 5G networks have so far come from Asian operators. It’s exciting to see a US company accelerate the rate of innovation and introduce new partners.”

The problem is that with 5G standards for the radio access network unlikely to be finalised by next year, any trial either in the US or Europe will be seen as an exploratory step along the way to commercial services which are at least five years away.

No operator is yet committing to 5G services before 2020 at the earliest.

Roger Gurnani, executive vice president and chief information and technology architect for Verizon said there is “a sense of urgency to push forward on 5G and mobilize the ecosystem by collaborating with industry leaders and developers.”

The trials, which will take place at Verizon’s testbeds in Waltham, Mass., and San Francisco, will test the 5G network’s capability to accommodate both wideband data services and narrowband connections to IoT devices. This will be one of the big challenges of 5G.

Another challenge will be defining the radio access network. Researchers in in Europe and Asia are considering using the radio spectrum at 60GHz, the so-called millimetre-wave band. This will provide the capacity needed for the anticipated 500MHz radio channels 5G will need.

Research is indicating there will be a completely new radio technology for the 5G mobile communications standard expected to hit the market by 2020.

Research work in Europe and China into the next generation mobile phone standard is now focusing on the use of millimetre wave radio transmission at very high 30-300GHz frequencies.

Japanese mobile operator NTT Docomo is working with US giants Intel and Qualcomm as part of its development of 5G research into mobile communications technologies.

Europe has the MiWaveS project which is intended to demonstrate how low-cost or advanced millimetre wave technologies can provide multi-gigabits per second access to mobile users and contribute to sustain the traffic growth.

It believes the exploitation of the available millimetre wave spectrum will be a key element in building high-throughput and low latency infrastructures for next generation heterogeneous mobile networks.

The UK’s main 5G research centre, the 5GIC at the University of Surrey is to be part of the MiWave S project.

Other project members include: CEA-Leti, Orange, Nokia, Intel, National Instruments Dresden and STMicroelectronics.

If implemented, this will represent the biggest technology change for a mobile generation since the switch from analogue to digital GSM technology more than a decade ago.

The standards work for the radio access network (RAN) only started this month at a 3GPP standards meeting in Arizona.

So what can we learn from the timing of 4G LTE trials. Verizon began testing 4G LTE as early as 2008 with the creation of a 10-cell network sandbox around Boston. This was two years before the launch of first commercial services.

By 2015, 87% of Verizon wireless data traffic is carried over the 4G LTE network.

 

 

Richard Wilson

Wearable Winners

imageTen winners have emerged from the ARM, Unicef, Frog competition for wearable tech. They are:

· CommunicAID, U.S: a bracelet that tracks medication treatment
· Droplet, U.S: a wrist-worn wearable water purification device
· Guard Band, Vietnam: a wristband that helps protect children from abuse
· Khushi Baby, India and U.S: a necklace-type wearable to track child immunization in the first two years of life
· Raksh, India: a device worn in the ear to track a child’s respiration rate, heart rate, body temperature and relative breath humidity designed by a team of university students
· Soapen, India and U.S.: an interactive crayon-like device that encourages hand washing among young children
· Telescrypts, East Africa and U.S: a wearable device to take patients’ vitals and send the data to health care workers
· TermoTell, Nigeria and U.S: a bracelet used to monitor and analyze a child’s temperature in real-time in order to save the lives of children at risk of malaria
· Totem Open Health Patch, Netherlands: a small sensor-based device that is part of a wider Totem Open Health system for wearable health technology
· WAAA!, U.K.: A sensor-based neonatal health surveillance tool.

The ten go through to the final in October and the two winners, who receive $15,000, will be announced in November in Helsinki and at Arm’s TechCon in Santa Clara.

There were 250 entries from 46 countries.

david manners

Wearable Winners

imageTen winners have emerged from the ARM, Unicef, Frog competition for wearable tech. They are:

· CommunicAID, U.S: a bracelet that tracks medication treatment
· Droplet, U.S: a wrist-worn wearable water purification device
· Guard Band, Vietnam: a wristband that helps protect children from abuse
· Khushi Baby, India and U.S: a necklace-type wearable to track child immunization in the first two years of life
· Raksh, India: a device worn in the ear to track a child’s respiration rate, heart rate, body temperature and relative breath humidity designed by a team of university students
· Soapen, India and U.S.: an interactive crayon-like device that encourages hand washing among young children
· Telescrypts, East Africa and U.S: a wearable device to take patients’ vitals and send the data to health care workers
· TermoTell, Nigeria and U.S: a bracelet used to monitor and analyze a child’s temperature in real-time in order to save the lives of children at risk of malaria
· Totem Open Health Patch, Netherlands: a small sensor-based device that is part of a wider Totem Open Health system for wearable health technology
· WAAA!, U.K.: A sensor-based neonatal health surveillance tool.

The ten go through to the final in October and the two winners, who receive $15,000, will be announced in November in Helsinki and at Arm’s TechCon in Santa Clara.

There were 250 entries from 46 countries.

david manners

GloFo reported to be looking for 5000 lay-offs

GloFo is reported to be looking at 5000 voluntary lay-offs in the US mainly from the chip operations it acquired from IBM.ibm

In July GloFo was paid $1.5 billion to take over IBM’s plants in East Fishkill, New York and Burlington, Vermont. It is these operations, employing 5000 people, which are expected to take the brunt of the lay-offs.

GloFo’s Fab 8 at Malta, New York is not expected to be affected. A proposed extension to that fab, known as 8.2, has already been halted

The lay-offs don’t affect GloFo operations in Singapore and Germany.

GloFo is blaming the recent downturn in the chip industry which saw TSMC’s August revenues fall 17% compared to July. TSMC blamed increasing inventory in the smartphone supply chain.

When, a year ago, GloFo originally announced its plan to take over iBM’s chip operation it said it did not intend to lay off IBM people. The voluntary buy-out scheme adheres to that commitment.

david manners

GloFo reported to be looking for 5000 lay-offs

GloFo is reported to be looking at 5000 voluntary lay-offs in the US mainly from the chip operations it acquired from IBM.ibm

In July GloFo was paid $1.5 billion to take over IBM’s plants in East Fishkill, New York and Burlington, Vermont. It is these operations, employing 5000 people, which are expected to take the brunt of the lay-offs.

GloFo’s Fab 8 at Malta, New York is not expected to be affected. A proposed extension to that fab, known as 8.2, has already been halted

The lay-offs don’t affect GloFo operations in Singapore and Germany.

GloFo is blaming the recent downturn in the chip industry which saw TSMC’s August revenues fall 17% compared to July. TSMC blamed increasing inventory in the smartphone supply chain.

When, a year ago, GloFo originally announced its plan to take over iBM’s chip operation it said it did not intend to lay off IBM people. The voluntary buy-out scheme adheres to that commitment.

david manners

23 more 300mm fabs by 2019, says IC Insights

By 2019 there should be 110 volume production 300mm fabs in the world compared to 87 today, reports IC Insights. The number of 300mm fabs will likely peak between 115-120.image

By comparison, the greatest number of volume-production 200mm wafer fabs in operation was 210 (the number declined to 154 fabs at the end of 2014).

The list of companies with the most 300mm wafer capacity includes memory suppliers Samsung, Micron, SK Hynix, and Toshiba/SanDisk; Intel; and the two largest pure-play foundries TSMC and GlobalFoundries.

200mm fabs be used to fabricate a range of ICs including specialty memories, display drivers, microcontrollers, analogue products, and MEMS.

TSMC, TI, and UMC remain the three companies with the greatest amount of 200mm wafer fab capacity.

450mm is not now expected in production until 2020.

david manners