PXI fault insertion switch module goes differential

Pickering Interfaces is expanding its range of PXI Fault Insertion switch modules with two cards designed for use with differential serial interfaces.

PXI fault insertion switch module goes differential

PXI fault insertion switch module goes differential

The first differential PXI module (model 40-200) is designed for lower data rate serial interfaces such as CAN and FlexRay.

A higher bandwidth switch module (model 40-201) is designed for higher data rate serial interfaces such as AFDX and 1000BaseT Ethernet.

The modules can be used to provide fault connections that include data paths open, data paths shorted together, and data paths shorted to externally applied faults such as power supplies and ground.

The software driver defaults to a protective mode where conflicting faults are prevented to avoid accidentally shorting unintended paths, such as power to ground. A separate mode allows complete freedom in setting fault patterns.

Connections are available on a easy to use 78-way D connector and are supported by Pickering’s range of general purpose (non-differential) cable and connector options.

 

Richard Wilson

PXI fault insertion switch module goes differential

Pickering Interfaces is expanding its range of PXI Fault Insertion switch modules with two cards designed for use with differential serial interfaces.

30sep15pickering-300x300The first differential PXI module (model 40-200) is designed for lower data rate serial interfaces such as CAN and FlexRay.

A higher bandwidth switch module (model 40-201) is designed for higher data rate serial interfaces such as AFDX and 1000BaseT Ethernet.

The modules can be used to provide fault connections that include data paths open, data paths shorted together, and data paths shorted to externally applied faults such as power supplies and ground.

The software driver defaults to a protective mode where conflicting faults are prevented to avoid accidentally shorting unintended paths, such as power to ground. A separate mode allows complete freedom in setting fault patterns.

Connections are available on a easy to use 78-way D connector and are supported by Pickering’s range of general purpose (non-differential) cable and connector options.

 

Richard Wilson

Leti fabs MEMS on 300mm wafers

Leti fabs MEMS on 300mm wafers

Leti fabs MEMS on 300mm wafers

French research fab CEA-Leti has manufactured accelerometers on 300mm wafers, thought to be a first for the MEMS industry.

“This demonstration that our 200mm MEMS platform is now compatible with 300mm wafer fabrication shows a significant opportunity to cut MEMS production costs,” said Leti CEO Marie Semeria. “This will be especially important with the expansion of the Internet of things and growing demand for MEMS in mobile devices.”

This is Leti’s ‘M&NEMS’ technology, based on detection by piezo-resistive silicon nanowires, which is claimed to reduce the size of multi-axis sensors. It also allows fabrication of combination sensors – for example three-axis accelerometer plus three-axis gyroscope plus three-axis magnetometers on the same chip. It is currently being transferred to “an industrial partner”, said the lab.

In addition: “manufacturing MEMS with 300mm technology enables 3D integration using MEMS CMOS processes in more advanced nodes than on 200mm, and the use of 3D through-silicon-vias, which is already available in 300mm.”

Details are being presented at the European MEMS Summit this week.

 

 

steve bush

Leti fabs MEMS on 300mm wafers

Leti fabs MEMS on 300mm wafers

Leti fabs MEMS on 300mm wafers

French research fab CEA-Leti has manufactured accelerometers on 300mm wafers, thought to be a first for the MEMS industry.

“This demonstration that our 200mm MEMS platform is now compatible with 300mm wafer fabrication shows a significant opportunity to cut MEMS production costs,” said Leti CEO Marie Semeria. “This will be especially important with the expansion of the Internet of things and growing demand for MEMS in mobile devices.”

This is Leti’s ‘M&NEMS’ technology, based on detection by piezo-resistive silicon nanowires, which is claimed to reduce the size of multi-axis sensors. It also allows fabrication of combination sensors – for example three-axis accelerometer plus three-axis gyroscope plus three-axis magnetometers on the same chip. It is currently being transferred to “an industrial partner”, said the lab.

In addition: “manufacturing MEMS with 300mm technology enables 3D integration using MEMS CMOS processes in more advanced nodes than on 200mm, and the use of 3D through-silicon-vias, which is already available in 300mm.”

Details are being presented at the European MEMS Summit this week.

 

 

steve bush

Leti fabs MEMS on 300mm wafers

Leti fabs MEMS on 300mm wafers

Leti fabs MEMS on 300mm wafers

French research fab CEA-Leti has manufactured accelerometers on 300mm wafers, thought to be a first for the MEMS industry.

“This demonstration that our 200mm MEMS platform is now compatible with 300mm wafer fabrication shows a significant opportunity to cut MEMS production costs,” said Leti CEO Marie Semeria. “This will be especially important with the expansion of the Internet of things and growing demand for MEMS in mobile devices.”

This is Leti’s ‘M&NEMS’ technology, based on detection by piezo-resistive silicon nanowires, which is claimed to reduce the size of multi-axis sensors. It also allows fabrication of combination sensors – for example three-axis accelerometer plus three-axis gyroscope plus three-axis magnetometers on the same chip. It is currently being transferred to “an industrial partner”, said the lab.

In addition: “manufacturing MEMS with 300mm technology enables 3D integration using MEMS CMOS processes in more advanced nodes than on 200mm, and the use of 3D through-silicon-vias, which is already available in 300mm.”

Details are being presented at the European MEMS Summit this week.

 

 

steve bush

Mentor tools up 64-bit ARM processors at AMD

Mentor tools up 64-bit ARM processors at AMD

Mentor tools up 64-bit ARM processors at AMD

Mentor Graphics is offering embedded Linux tools for AMD’s 64-bit ARM processors as part of its Embedded Sourcery CodeBench Lite tool set.

The two companies have been working together for a year creating an ecosystem open-source, embedded C/C++ development tools for AMD’s 64-bit processors based on the ARMv8 core.

The microcontrollers can be designed into RTOS, bare metal, and Linux-based applications.

Sourcery CodeBench is an IDE based on Eclipse, the Eclipse C/C++ development tools and compilers, and GNU tool chain, including an assembler, linker, runtime libraries, and source-level and assembly-level debuggers.

3dc99de

Charlene Marini, v-p marketing, ARM

“AMD and Mentor Graphics’ support of the ARMv8-A embedded Linux ecosystem will shorten advanced system development cycles, reduce risk and improve product reliability,” said Charlene Marini, vice president of marketing, Embedded Segments, ARM.

The ARMv8 architecture is ARM’s first 64-bit processor architecture which is compatible with existing 32-bit software.

The current ARM processors supporting the ARMv8-A architecture are the Cortex-A72, Cortex-A57 and Cortex-A53 processors.

 

 

 

Richard Wilson

Mentor tools up 64-bit ARM processors at AMD

Mentor tools up 64-bit ARM processors at AMD

Mentor tools up 64-bit ARM processors at AMD

Mentor Graphics is offering embedded Linux tools for AMD’s 64-bit ARM processors as part of its Embedded Sourcery CodeBench Lite tool set.

The two companies have been working together for a year creating an ecosystem open-source, embedded C/C++ development tools for AMD’s 64-bit processors based on the ARMv8 core.

The microcontrollers can be designed into RTOS, bare metal, and Linux-based applications.

Sourcery CodeBench is an IDE based on Eclipse, the Eclipse C/C++ development tools and compilers, and GNU tool chain, including an assembler, linker, runtime libraries, and source-level and assembly-level debuggers.

3dc99de

Charlene Marini, v-p marketing, ARM

“AMD and Mentor Graphics’ support of the ARMv8-A embedded Linux ecosystem will shorten advanced system development cycles, reduce risk and improve product reliability,” said Charlene Marini, vice president of marketing, Embedded Segments, ARM.

The ARMv8 architecture is ARM’s first 64-bit processor architecture which is compatible with existing 32-bit software.

The current ARM processors supporting the ARMv8-A architecture are the Cortex-A72, Cortex-A57 and Cortex-A53 processors.

 

 

 

Richard Wilson

Mentor tools up 64-bit ARM processors at AMD

Mentor tools up 64-bit ARM processors at AMD

Mentor tools up 64-bit ARM processors at AMD

Mentor Graphics is offering embedded Linux tools for AMD’s 64-bit ARM processors as part of its Embedded Sourcery CodeBench Lite tool set.

The two companies have been working together for a year creating an ecosystem open-source, embedded C/C++ development tools for AMD’s 64-bit processors based on the ARMv8 core.

The microcontrollers can be designed into RTOS, bare metal, and Linux-based applications.

Sourcery CodeBench is an IDE based on Eclipse, the Eclipse C/C++ development tools and compilers, and GNU tool chain, including an assembler, linker, runtime libraries, and source-level and assembly-level debuggers.

3dc99de

Charlene Marini, v-p marketing, ARM

“AMD and Mentor Graphics’ support of the ARMv8-A embedded Linux ecosystem will shorten advanced system development cycles, reduce risk and improve product reliability,” said Charlene Marini, vice president of marketing, Embedded Segments, ARM.

The ARMv8 architecture is ARM’s first 64-bit processor architecture which is compatible with existing 32-bit software.

The current ARM processors supporting the ARMv8-A architecture are the Cortex-A72, Cortex-A57 and Cortex-A53 processors.

 

 

 

Richard Wilson

EC nods through NXP-Freescale merger

The NXP and Freescale merger has been approved by the EC.

NXP CEO Rick Clemmer

NXP CEO Rick Clemmer

The condition was the disposal of NXP’s power amplifier business which has been sold to JAC Capital of China.

The EC’s ruling stated: “The Commission found that NXP and Freescale are the two largest players and close competitors in the RF power transistors market, in particular those used in base stations for mobile telecommunications. The Commission was concerned that after the merger, as originally notified, the remaining companies on the market would have been unable to exercise sufficient competitive pressure on the merged entity. This could have led to price rises and a reduced choice for customers.”

NXP got $1.8 billion for the business.

Freescale was No.2 in micro-controllers last year while NXP was No.5 but, although the combined company will have a big market share, the EC recognises that the sector will still be competitive.

NXP has a market cap of $23 billion and Freescale has a market cap of $13 billion.

More information will be available on the competition website, in the Commission’s public case register under the case number M.7585.

See also: NXP sells CMOS sensor business to ams

See also: Will car makers become internet companies?

See also: USB will carry 4K video with new connector design

Read more NXP stories on Electronics Weekly »

 

david manners

EC nods through NXP-Freescale merger

The NXP and Freescale merger has been approved by the EC.

NXP CEO Rick Clemmer

NXP CEO Rick Clemmer

The condition was the disposal of NXP’s power amplifier business which has been sold to JAC Capital of China.

The EC’s ruling stated: “The Commission found that NXP and Freescale are the two largest players and close competitors in the RF power transistors market, in particular those used in base stations for mobile telecommunications. The Commission was concerned that after the merger, as originally notified, the remaining companies on the market would have been unable to exercise sufficient competitive pressure on the merged entity. This could have led to price rises and a reduced choice for customers.”

NXP got $1.8 billion for the business.

Freescale was No.2 in micro-controllers last year while NXP was No.5 but, although the combined company will have a big market share, the EC recognises that the sector will still be competitive.

NXP has a market cap of $23 billion and Freescale has a market cap of $13 billion.

More information will be available on the competition website, in the Commission’s public case register under the case number M.7585.

See also: NXP sells CMOS sensor business to ams

See also: Will car makers become internet companies?

See also: USB will carry 4K video with new connector design

Read more NXP stories on Electronics Weekly »

 

david manners