Electronics production in the major developed countries has been showing slow growth or declines in 2024. United States electronics production three-month-average change versus a year ago (3/12 change) was 0.4% ...
The post Electronics production shows decline or slow growth appeared first on Electronics Weekly.
Intel is to get $8.5 billion of Chips Act money by the end of the year, reports the FT, but the grant is said to be contingent on it not ...
The post Intel to get Chips Act funds by year-end but must not sell units to Arm, Qualcomm appeared first on Electronics Weekly.
Following the revelation of a $7 billion funding gap in the budget of Rapidus the Japanese startup targeting 2nm manufacturing capability, three Japanese banks have a agreed to put up ...
The post Rapidus raises another$175m but $20bn+ still needed appeared first on Electronics Weekly.
Broadcom, Charter Communications, and Comcast have announced a joint development of Unified DOCSIS chipsets for network nodes, smart amps, and cable modems, enabling both FDX and ESD versions of the ...
The post Broadcom, Charter, Comcast to develop unified DOCSIS chipsets appeared first on Electronics Weekly.
Siemens Digital’s Calibre Platform tool has been certified for TSMC’s N2 and N2P processes. The N2 certification includes the new LSVRF (Local Standard Verification Rule Format) functionality in Calibre, which ...
The post Siemens EDA certified on TSMC N2 appeared first on Electronics Weekly.
A new report by space consultancy firm Novaspace estimates the size of the satellite market by 2033, including a launch forecast for the next decade. According to its latest ‘Satellites ...
The post Seven tons of satellites to be launched daily reports Novaspace appeared first on Electronics Weekly.
The MIPI Alliance has released version 2.0 of its A-PHY asymmetric SerDes (serialiser-deserialiser physical-layer interface, doubling its down-link speed to 32Gbit/s, and increasing its top up-link speed eight-fold to 1.6Gbit/s. ...
The post A-PHY v2.0 released for automotive comms appeared first on Electronics Weekly.
Just when you thought there was nothing new in manual wire splicing connectors, Kyocera has announced something else to replace crimp and solder connections. “9179-000 Series IDC Splice Connectors are ...
The post Insulation displacement connectors for loose wires appeared first on Electronics Weekly.
At the TSMC OIP Ecosystem Forum in Santa Clara, Synopsys announced EDA tool, IP and process collaborations. The two companies confirmed tapeout of a multi-die test chip combining 3DFabric and ...
The post Synopsys and TSMC collaborate with EDA and IP for A16 and N2 processes appeared first on Electronics Weekly.
A simple non-contact camera technique has been used to analyse blood lipid levels after someone eats high-fat and low-fat meals, and agrees well with blood sample based measurements. Spatial frequency ...
The post Camera and AI open a window on heart health appeared first on Electronics Weekly.
