At ECTC, French research lab CEA-Leti has reported stacking three 300mm wafers for improved CMOS image sensors, using hybrid wafer bonding and high-density through-silicon vias. It is working towards a ...
The post ECTC: Triple wafer stacking for image sensors with embedded AI appeared first on Electronics Weekly.
TDK has introduced a radio wave absorber material with more than 25% or biomass by weight. Called the IS-BP series, the foams are intended to line the ceiling, walls and ...
The post RF absorber has 25% biomass appeared first on Electronics Weekly.
Alpha and Omega Semiconductor is aiming at Meteor Lake and Arrow Lake notebooks with a multi-phase dc-dc converter controller that meets Intel IMVP 8, 9, 9.1, and 9.2 specifications. AOZ71137QI ...
The post Three rail multi-phase dc-dc controller meets Intel IMVP 9.2 appeared first on Electronics Weekly.
Farnell is to stock a range of 3D printing filamants under its Multicomp Pro brand, aiming at “design engineers, creators and hobbyists”, it said. “As interest and demand in 3D ...
The post Farnell offers own-brand 3D printing filament appeared first on Electronics Weekly.
Connector distributor Lane Motorsport has hosted Loughborough University student racing car development team (LUMotorsport) at its Sussex manufacturing facility. “We have been supporting LUMotorsport with their design efforts for a ...
The post Student e-racing team hands on with connectors at Lane appeared first on Electronics Weekly.
Specialist electric car maker The Little Car Company is celebrating three years since it delivered its first vehicle. The company creates slightly scaled down versions of classic vehicles, powered by ...
The post Little Car Company hits three years appeared first on Electronics Weekly.
Toshiba has announced 300mA LDOs in a 1 x 1 x 0.37mm DFN4D package. Quiescent current is typically 1.2μA with no load. They are “specifically aimed at applications powered by ...
The post 300mA LDOs in 1mm package appeared first on Electronics Weekly.
Transistor maker Cambridge GaN Devices has signed a memorandum of understanding with Taiwan’s Industrial Technology Research Institute to develop USB-PD adaptors as well as to share international market information, visit ...
The post Cambridge GaN devices signs with Taiwan PSU institute to design USB-PD adaptors appeared first on Electronics Weekly.
Texas Instruments is planning a pair of precision current monitors that can measure ±50A over -4 to 110V. They are the standard INA791B (right) and the PWM residue rejecting INA790B ...
The post 50A bidirectional current monitors measure within -4 to +110Vdc appeared first on Electronics Weekly.
Banner Engineering has created an eight-port smart hub to couple 16 discrete input-outputs to a single IO-Link serial bus cable for industrial networks. “R130C is a compact top-exit IO-Link hub ...
The post 8 port PNP to IO-Link hub for industrial networks appeared first on Electronics Weekly.
