Author Archives: steve bush

ISSCC 2022: MEMS senses zeptograms

‘Zeptogram’ caught the eye at ISSCC 2022 conference last week, as researchers from French lab CEA-Leti produced a mass sensor with 170zg resolution for weighing molecules. Not only did they make one such sensitive weighing scale, but 1,024 of them in an array which can be scanned at high speed. The weighing part had been ...

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ISSCC: UK-made bendable 6502 MCU has 16,000 thin-film transistors

The fastest bendable 8bit thin-film microcontroller was describe at the International Solid-State Circuits Conference this week. Designed by Belgian research lab Imec and nearby university KU Leuven, it was made by UK-based PragmatIC Semiconductor. Called Flex6502, is has 16,000 0.8µm gate-length IGZO (indium gallium zinc oxide) transistors over a 4.5 x 5.5mm active area (see photo, ...

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60V 30A GaN motor drive for drones, robotics and e-bikes

EPC is offering a three-phase motor driver evaluation board built around 80V 3.6mΩ GaN power transistors, sized for drones, robotics and e-bikes. “The small size of this inverter allows integration into the motor housing resulting in the lowest EMI, highest density and lowest weight,” said the company. Called EPC9167HC, the design uses two paralleled EPC2065 ...

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3.8-32V automotive buck converters in TSOT26

Diodes has launched a series of automotive-compliant synchronous buck converters for delivering up to 3A in automotive point-of-load converters in 3 x 2.8mm TSOT26 packages With 2A and 3A ratings, AP6320xQ and AP6330xQ respectively can operate with inputs from 3.8 to 32V and over -40 to +125°C. 3A versions integrate 70/40mΩ (high/low-side) mosfets, or 125/68mΩ for the 2A parts. There are ...

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Automotive three-terminal capacitor packs 4.3μF into 0.5mm2

Murata has managed to compress 4.3μF into a three-terminal 0402 (1005 metric) package, and qualified it for automotive use. This is the surface-mount equivalent of a feed-through capacitor, with the end terminals connected together by a low-resistance direct path. This path is one end of the capacitor, whose other end is to be grounded via ...

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ISSCC: GaN PSU switches 400V at 50MHz

A blisteringly fast 400V monolithic gallium nitride power buck converter featured at the International Solid-State Circuit Conference (ISSCC) this week. Its figures speak for themselves: 50MHz operation, sub-200ps dead-time, and 120V/ns slew rate at the switching node. The child of National Chiao Tung University and Realtek Semiconductor, both in Taiwan, the IC is GaN-on-silicon, combining a ...

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ISSCC: Cunning one-chip mains PSU needs only external passives

At ISSCC 2022, the Leibniz University of Hannover presented a novel 50-60Hz universal mains ac-dc power supply that has almost all of its components on a single 3 x 7mm 0.18μm silicon-on-insulator die. The only external components are the output inductor and capacitor, both low-voltage parts. It can produce an adjustable 3.3 to 10Vdc from ...

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Silicon anode material licenced from Nexeon

Oxfordshire silicon anode firm Nexeon has has licensed its NSP-1 material to Korean giant SKC, an investor in Nexeon. “Silicon-graphite hybrid electrodes are now delivering superior performance in hybrid and EV vehicles,” said SKC v-p Junghwan Shin. This arrangement follows the investment and strategic partnership announced between the two companies in January, and represents further ...

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ISSCC 2022: Machine learning processors

It takes a lot of effort to avoid machine learning processors at this year’s IEEE International Solid-State Circuits Conference, as they popped up not only amongst digital processing papers, but also next to memory and analogue papers. For example, of all the thousands of companies designing ICs around the world, only four were invited to ...

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Isolated gate driver works up to 2.3kV

Infineon has created a family of single-channel isolated gate driver for IGBTs and silicon carbide mosfets with up to 300kV/μs common-mode transient immunity and up to +6  and -8.5 A typical peak current. Called 1ED332x, and branded ‘F3 Enhanced’, they come in 300mil wide DSO 16 packaging with 8mm creepage distance. Operation is expected with devices ...

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