Author Archives: richard wilson

Omron says USB environmental sensor monitors seven functions

Omron Electronic Components Europe has introduced a new version of its USB multi-function environmental sensor that that can monitor seven parameters. The 2JCIE-BU01 offers multiple sensors in one unit that has built-in memory and connectivity through beacon communication. It  measures 14.9 x 29.1 x 7.0mm and can monitor temperature, humidity, light, UV, barometric pressure, noise, ...

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CompactPCI gets performance boost and security features

A high performance CompactPCI computer board has been introduced by Concurrent Technologies. It has a 6-core processor Intel Xeon processor E-2176M, which means it is significantly higher performance than previous generation 6U CompactPCI boards. The result, says Concurrent Technologies, it should be possible to extend the life of existing deployments based on this long-established form ...

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Teledyne e2v qualifies QorIQ Power PC multi-threaded CPUs

Teledyne e2v has qualified and released the first two up-screened versions of NXP’s T-Series processors to operate at -55°C to 125°C.  The T-Series is the latest generation of QorIQ Power PC multi-threaded CPUs. The military grade qualified devices are available in both RoHS and leaded packages.   As part of Teledyne e2v’s Semiconductor Lifecycle Management ...

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Yokogawa targets data logging in high voltage electric vehicles

Yokogawa Electric has developed a high-voltage analogue input module for data collection in the development and production of electric vehicles (EVs) and plug-in hybrid vehicles (PHVs). The GX90XA-10-V1 module provides measurement of multiple channels under high-voltage conditions as part of its OpreX data acquisition range.  For the development and production of EVs and PHVs, and ...

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Autumn Statement: Chancellor bets on driverless car tech

Chancellor of the Exchequer Phillip Hammond outlined in the Autumn Statement the creation of an National Productivity Investment Fund to invest in the nationals digital infrastructure. But it will also see £100m invested in the development of infrastructure for autonomous vehicles, the much talked about ‘driverless cars’. The Chancellor ear-marked £390m for transport technology, including £80m for charging infrastructure for electric vehicles ...

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Autumn Statement: Match tech investment with skills, says RAE

Government plans for new investment in infrastructure and R&D in the Autumn Statement, will be good for the engineering and technology sectors, says the Royal Academy of Engineering. This follows the Chancellor of the Exchequer’s commitment of £2bn per year by 2020 for research and development funding and £1bn for digital infrastructure. Professor Dame Ann Dowling, President of the Royal Academy ...

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Open source community seeks “balance” in IoT radio regulations

The open-source community behind the MIPS processor is working with the US regulator the Federal Communications Commission (FCC) in the area of software controlled radio technology for IoT. Eric Schultz, community manager with the prpl Foundation will advise on how proposed FCC regulations may affect the open source community and the growth of the internet of ...

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SoC design verification at all levels is key, says Cadence

Verification technology has advanced significantly over the last few years and with today’s SoC design, verification needs to be done at all levels, from the system down to the silicon in parallel, moving up and down the levels as appropriate, writes  Paul McLellan, Cadence Design Systems. The key verification technologies are formal approaches, simulation, virtual platforms, ...

SoC design verification at all levels is key, says Cadence

CEA-Leti believes FD-SOI chips work better under pressure

French research centre CEA-Leti believes it has developed a semiconductor process technology technique which will produce faster ICs using FD-SOI (fully-depleted silicon on insulator) processes. The Grenoble-based centre has developed two techniques to induce local strain in FD-SOI processes and it believes the result will be faster chips with no power penalty. The techniques apply compressive ...

CEA-Leti believes FD-SOI chips work better under pressure