Adhesive suppliers tackle a range of new bonding applications.

EC-1015HP epoxy potting compound provides significantly better crack resistance than traditional rigid epoxies.

DELO Dualbond EG6290 is a new sealant for CMOS image sensors, which are often used in driver monitoring systems.

Whether you need a UV-cure adhesive to assemble a medical device or a two-part epoxy to encapsulate electronics, you’ll find it at The ASSEMBLY Show South. Here’s a look at some of what you’ll see.

New products have been introduced for bonding applications in the automotive, medical and electronics industries.

UC-2210M is a urethane formulated to protect electronic components in high moisture and thermal environments.

Automotive supplier uses collaborative robots to install connectors and other odd-form components in circuit boards.

A dozen SCARA robots produce more than 2 million connectors annually.

The S Jet Superior modular dispensing valve is versatile.

The AeroJet is a noncontact jet dispenser designed for medium- to high-viscosity materials.