Distrelec, a trading brand of RS Group plc, a global provider of product and service solutions for industrial customers, is proud to introduce its new Better World product range. Initially ...
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Infineon has introduced Power System Reliability Modeling to prevent or reduce the cost of power outages faced by data centres and telecom infrastructure. With 39% of downtimes attributed to power ...
The post Power outages protection devices appeared first on Electronics Weekly.
Black Semiconductor, the four year-old German startup pursuing graphene ICs, has secured €228.7 million from the German Ministry of Economic Affairs and Climate Action and the state of North Rhine-Westphalia ...
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Element Six (E6) and Orbray, the advanced materials specialists, are collaborating to deliver wafer-scale single crystal (SC) synthetic diamond. Industrial applications across telecommunications, defence, and AI will place unprecedented demands ...
The post Element 6 and Orbray hook up on diamond wafers appeared first on Electronics Weekly.
The Li-ion battery packs market for BEV and PHEV is forecast to grow from around $97 billion in 2023 to $188 billion by 2029, with an 11.6% CAGR between 2023 ...
The post Li-ion battery market to have 11.6% CAGR 2023-29 to reach $188bn appeared first on Electronics Weekly.
A MOU signed by Under Secretary of Commerce for Intellectual Property, USPTO Director Kathi Vidal and the Chief Executive Officer of the United Kingdom Intellectual Property Office (UKIPO) Adam Williams ...
The post UK and US sign SEP MoU appeared first on Electronics Weekly.
Raspberry Pi has set a price for its IPO which will value the company at about £542 million. In pre-offer ‘conditional dealing’ for institutions the price per share rose by ...
The post Raspberry Pi IPO looking good appeared first on Electronics Weekly.
Intel has delayed Fab 38 in Kiryat Gap, Israel, reports Calcalist. “Israel continues to be one of our key global manufacturing and R&D sites and we remain fully committed to ...
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Cambridge GaN Devices has announced two new packages for its ICeGaN family of GaN power ICs which enhance thermal performance and simplify inspection. The DHDFN-9-1 (Dual Heat-spreader DFN) is a ...
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Q1 semiconductor manufacturing equipment billings fell 2% y-o-y to $26.4 billion while q-o-q billings dropped 6%, says SEMI. “Despite the slight dip in global semiconductor equipment billings, our industry remains ...
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