Author Archives: david manners

X-Fab builds two new MEMS fabs

X-FAB Silicon Foundries has expanded its MEMS manufacturing capabilities in Erfurt and Itzehoe with two new dedicated MEMS fabs with cleanroom space totaling more than 2000 square metres.

MEMS devices manufactured at X-FAB include pressure sensors, micro-mirrors, microphones and microfluidic devices used in mobile, consumer, medical and automotive applications.

“With the two new dedicated MEMS fabs, we are well prepared for volume MEMS manufacturing and able to meet the growing demand we see from our customers,” says X-Fab’s Peter Merz.

In Erfurt, X-FAB will use 1300 square metres of new MEMS manufacturing space alongside its existing CMOS and MEMS semiconductor fabs on site. The new cleanroom will be used for high-volume manufacturing of 200mm MEMS and related processes with the first equipment to be installed in December this year.

In Itzehoe, X-FAB is moving its operation into a new state-of-the-art 1000 square metre fab commonly used with Fraunhofer ISIT.

In addition, X-FAB will expand its R&D cooperation with Fraunhofer Institute. The Itzehoe fab was opened last month with the first tools already installed.

“X-FAB offers a variety of CMOS processes for analog/mixed signal, high-voltage and power applications in combination with a wide range of MEMS process capabilities,” says Merz, “customers benefit from this one-stop-shopping approach. In addition, X-FAB simplifies the supply chain by supporting integration and interface challenges on all levels.”

Qualcomm dominates China LTE market

Qualcomm SnapdragonQualcomm is the biggest supplier of China’s LTE chip market, of which it is expected to take over 80% in the first half of 2014, reports Digitimes.

Qualcomm is currently pushing its Snapdragon 400 series as the mainstream platform for the LTE market and because of the series’ friendly pricing and strong performance/function balance, the platform has achieved high popularity in the market.

Qualcomm is set to release its entry-level 64-bit Snapdragon 410 series in the third quarter of 2014, looking to accelerate shipment growths.

Marvell released its LTE solutions at the same time as Qualcomm, but limited by its business scale and supporting personnel, Marvell has been unable to offer a technology support as competitive as Qualcomm’s, while component costs for its solutions are also higher. It has a lot less clients than Qualcomm.

Despite the fact that Marvell and Qualcomm both released their LTE solutions at about the same time, Marvell’s LTE chip shipments have been a lot weaker than those of Qualcomm.

Meanwhile, MediaTek continues to achieve growth in 3G-related chip markets. The chipmaker’s quad-core and eight-core products are achieving rapid growth in the second quarter and have become the main revenue contributors.

Although MediaTek has already developed independent LTE baseband chips and released related solutions to the market, demand for the solutions is limited and significant shipments are unlikely until the third quarter.

However, by then, the entry-level market, where MediaTek has a strong presence, may have already been occupied by Qualcomm’s 32-bit and 64-bit solutions and MediaTek is likely to be forced to offer same-spec-but-cheaper solutions to compete for orders, Digitimes  believes.

MediaTek currently still lacks plans for 64-bit products. MediaTek’s high-end 32-bit MT6595 is able to outrace Qualcomm’s Snapdragon 801/805 in terms of performance, but for the 64-bit product line, MediaTek currently still has nothing to compete against Qualcomm’s upcoming 64-bit 808/810 series.

The aPhone arrives

Amazon PhoneAmazon launched its phone yesterday. It’s a 4.7 inch phone with a 13 megapixel camera, a 2.2 GHz processor and free photo storage.

It can be controlled by tilting it, by eyeball tracking and by moving it from side to side.

It links with Amazon Prime, Kindle and Amazon cloud storage

The US cost, through AT&T, is $199.99 with a 2-year contract for a 32 GB model. A 64 GB model costs $299.99. Without a contract, the phone will cost  $649.99.

Pre-orders for the phone begin Wednesday, and the phones will be available starting July 25.

MA/COM low-noise amplifier

MACOM MAAL-011078M/A-COM has announced a low noise, high gain amplifier for wireless infrastructure, WiFi and L- and S- Band applications.

MAAL-011078 is a low noise amplifier that offers ultra-low noise figure and high gain from a single stage.  The Low Noise Amplifier (LNA) covers wide bandwidth between 700MHz and 6GHz with excellent noise figure, OIP3 and gain.  The return loss can be optimized over narrow bands by implementing simple external matching networks.  The integrated active bias circuit allows direct connection to 3V or 5V voltage supply and minimizes variations over temperature and process.  The bias circuit voltage supply (VBIAS) can be utilized as an enable pin to power the device up and down during operation.

“This LNA is a designed as a second generation of MAAL-011076 and MAAL-011075.  It is designed using very low noise process and has more gain and bandwidth than any other LNA in the market,” said Amer Droubi, Product Manager, MACOM. “Matching is done externally in order to enable customers to make the necessary compromise between return loss, gain, OIP and noise figure.”

“This

Wind River’s Titanium Cloud

Wind River has launched its Titanium Cloud programme to ensure the availability of optimized, interoperable hardware and software products for network operators and telecom equipment manufacturers deploying infrastructure based on network functions virtualization (NFV).

Currently, five industry leaders in NFV announced their participation in the program: Brocade, GENBAND, Metaswitch Networks, Nakina Systems, and Overture; with additional partners to follow.

Like its Titanium namesake, the Wind River ecosystem will build products based on the Carrier Grade Communications Server platform.

Carrier Grade Communications Server is an integrated portfolio of software elements that enables NFV infrastructure to achieve the carrier grade reliability required for telecom networks.

Legacy networks deliver six-nines (99.9999%) reliability, or no more than 30 seconds downtime per year. Platforms based on enterprise-class software designed for IT applications, however, typically achieve only three-nines (99.9%), or almost nine hours of downtime per year, which would result in excessive costs and revenue loss.

Carrier Grade Communications Server is the only commercial NFV server solution that enables service providers to maintain six-nines reliability as they transition to virtualized infrastructure, allowing them to meet “always on” expectations.

In addition, by accelerating the performance of virtual network functions (VNFs) and providing features that simplify the instantiation, management, and maintenance of VNFs, Carrier Grade Communications Server enables customers to minimize both capital expenses (CAPEX) and operating expenses (OPEX) as they progressively deploy NFV in their networks.

Knowles, Infineon dominate MEMS microphone market

Knowles and Infineon dominate the market for microelectromechanical system (MEMS) microphone chips.

Knowles of the U.S. in 2013 was the biggest supplier of packaged MEMS microphones ready for assembly on printed circuit boards, according to  IHS Technology.

MEMSmicrophone marketsGermany’s Infineon, meanwhile, was the leader one layer below, supplying bare MEMS dies to MEMS microphone makers. Knowles accounted for 59 percent of the market’s total revenue among packaged MEMS microphone suppliers, while Infineon owned 78 percent of the MEMS die trade in terms of unit shipments.

Among microphone suppliers, Illinois- based Knowles remained far and away the leader, even managing to increase its revenue share last year to 59 percent, up from 55 percent in 2012. Knowles has been particularly successful in growing its business, via high-performance microphones priced at a premium, for Samsung and particularly for Apple, which is the leading buyer of MEMS microphones and dictates supply chain dynamics in the area. Knowles supplies, for instance, two of the three high-performance MEMS microphones in Apple’s iPhone 5s, as well as one of three in the iPhone 5.

MEMS microphones are increasingly important differentiators in smartphones, with the highest-quality devices proving helpful in ambient-noise cancellation and also in delivering crystal-clear audio in high-definition video. Apple was the first to use high-performance MEMS microphones, initially seen in 2012 with the iPhone 5, with Samsung then following suit shortly afterward via its Galaxy S4 and Note 3 smartphones. MEMS microphones are now also found in tablets like the Apple iPad, as well as in Apple headsets.

At a distant second after Knowles was AAC with 13 percent revenue share, followed by No. 3 Goertek with 7 percent share; both suppliers are from China whose business also heavily depends on Apple. AAC supplies one of the three high-performance microphones in the iPhone 5 and is now in the 5s, while Goertek is the main supplier for the MEMS microphone in the headset that sells along with the iPhone. AAC grew 8 percent, and Goertek had even greater growth at 35 percent as it started delving into high-performance microphones for mobile handsets.

Meanwhile, fourth-ranked BSE of South Korea reaped the benefits of supplying to Apple rival Samsung, pushing up the microphone maker’s revenue by more than 250 percent from 2012 to 2013.

Rounding out the top five and tied in fourth place with BSE was French-Italian maker STMicroelectronics, which continued to see its MEMS microphone business expand after gaining impressive design wins in the iPad.

While Knowles, the pioneer and market leader, designs its own MEMS, an increasing number of MEMS microphone suppliers focus on packaging.

Including makers such as AAC, Goertek, BSE and Japan’s Hosiden, these companies buy a standard MEMS die and an application-specific integrated circuit (ASIC), and then package them for selling under their own brand. All four companies are manufacturers, historically, of conventional electret condenser microphones—an older technology that cannot match MEMS in performance and miniaturization important for mobile devices. The four makers have no traditional MEMS or semiconductor background, and their expertise lies in acoustics as well as assembly and packaging.

In the MEMS bare die business where Infineon rules, the German maker owns nearly three-quarters of total shipments, supplying to major customers like AAC, Goertek, BSE, Hosiden and another Chinese buyer, Gettop. Infineon’s growth is remarkable: up 204 percent in 2011; and up another 50 percent from 2012 to 2013.

Two suppliers, however, are angling for a bigger slice of the business: Omron Corp. and New Japan Radio, both Japanese-based. Omron is expanding to customers in China and Taiwan besides serving main customer STMicroelectronics, which potentially could be developing its own microphone die. For its part, New Japan Radio is gaining headway thanks to headset sales to a Korean module maker.

The bare die business, in particular, is plagued by inflated inventory building in order to compensate for yield losses at various steps of the supply chain—from the wafer dicing stage to the packaging phase, and onward to assembly on the printed circuit board.

Inventory building is especially high in the supply chain serving Apple.

“Because Apple releases a huge-selling handset every year, and given the severe penalties imposed by Apple for delays, the MEMS microphone supply chain must overestimate component supplies in order to ensure it can meet Apple’s demand,” said Marwan Boustany, senior analyst for MEMS and sensors at IHS. “This, in turn, leads to microphone inventory being accumulated at every point in the supply chain.

2014 resurgence for power transistors, forecasts IC Insights

IC Insights - Worldwide power transistor salesAfter consecutive sales declines in 2012 and 2013, the power transistor market is forecast to climb 8% in 2014 and reach a new record high in 2015, says IC Insights.

For more than three decades, power transistors have been the growth engine in the $21 billion commodity-filled discrete semiconductor market, handling the vital job of controlling, converting, and conditioning currents and voltages in an ever-expanding range of electronics—including battery-operated portable products, new energy-saving equipment, hybrid and electric vehicles, “smart” electric-grid applications, and renewable power systems.

However, the power transistor marketplace has uncharacteristically struggled for the past two years, posting the first back-to-back annual sales declines in more than 30 years (-8% in 2012 and -6% in 2013) due to delays in unit purchases by cautious equipment makers responding to economic uncertainty and price erosion from excess production capacity.

The two-year losing streak for power transistors is expected to end in 2014, with worldwide sales rebounding 8% to $12.5 billion.

IC insights forecasts power transistor sales rising 9% in 2015 to $13.7 billion, topping the current annual peak of about $13.5 billion set in 2011.

With economic uncertainty easing and end equipment sales gaining strength, the power transistor market is projected to increase by a compound annual growth rate (CAGR) of 6.4% between 2013 and 2018, reaching $15.7 billion in 2018.

The projected rate of annual sales growth is more than double the 3.0% CAGR in the previous five years (2008-2013), when power transistors and nearly all other semiconductor categories were pulled down by the financial-meltdown recession and lingering economic weakness after the strong 2010 recovery.

The 2014 rebound in power transistors will be led by low-voltage MOSFETs (up to 40V), high-voltage MOSFETs (over 400V), and insulated-gate bipolar transistor (IGBT) products that are often used in high-current applications and systems operating in rugged conditions, such as in vehicles, lighting equipment, air conditioners and heaters, motor drives, factory equipment, and industrial gear, such as welders.

IC Insights expects to see 2014 sales growing 9% in low-voltage MOSFETs (to nearly $2.8 billion), high-voltage MOSFETs (to about $1.8 billion) and IGBT power modules (to $2.7 billion).

Even bipolar junction power transistors, which have been around for more than five decades, are expected to see a 6% increase in sales to $854 million in 2014 after dropping 10% in 2013.

Since power transistors cannot be efficiently merged into integrated circuits, it stands to reason that sales growth in power transistors has nearly matched the CAGR of ICs since the early 1980s.

Between 1984 and 2013, worldwide sales of power transistors have grown by a CAGR nearly 8% compared to an annual average of 9% for ICs.

IC and power transistor sales are expected to rise by a CAGR of about 6% in the next five years.

Power transistors are expected to represent about 59% of the projected $26.7 billion in total discrete semiconductor sales in 2018 versus 56% of the $20.7 billion market in 2013.

Strong demand for power transistors will continue to be fuelled by the steady growth in battery-operated portable products, global efforts to reduce consumption of electricity with new energy-efficient power supplies in equipment, earth-friendly solar and wind power systems, and ongoing efforts to improve plug-in electric and hybrid vehicles.

Renesas expands R-IN32M3

Renesas r-in32m3

Renesas R-IN32M3

Renesas has expanded its R-IN32M3 series platform solution for industrial Ethernet protocols with an IAR Systems development kit and multiple Industrial Ethernet protocol stacks support.

IAR Systems eases device evaluation with the release of its IAR KickStart Kit for R-IN32M3 SoCs.

The kit includes an R-IN board, an I-jet Lite debug probe and evaluation versions of IAR Embedded Workbench for ARM, as well as lots of protocol stacks.

The Smart Factory means that communication networks have become a critical component in improving production efficiency and real-time processing.

The number and complexity of industrial protocols like CC-Link IE, EtherCAT, PROFINET, etc., as well as a variety of applications, has led to long and complex development cycles.

Renesas’ R-IN32M3 series of devices improves industrial Ethernet network performance with optimised hardware accelerators, while reducing costs by supporting multiple protocols such as EtherCAT, CC-LinkIE, EtherNet/IP, PROFINET, CANopen and others, from a single device. It can be used for real-time network communication in gateways, I/O controllers, PLCs/PACs, embedded controllers, industrial drives and countless other networked applications.

Key features of R-IN32M3 include:

ARM Cortex M3-based CPU subsystem clocked at 100 megahertz (MHz) clock speed
Hardware accelerators improve efficiency and offloads from the main CPU
Hardware real-time OS accelerator (HW-RTOS)
Hardware Ethernet accelerators (IP/TCP/UDP Check Sum, Header ENDEC, Buffer manager)
1.3 MB of on-chip RAM
EtherCAT or CC-Link IE slave controller on-chip (license free)
2-port real-time Gigabit switch, supports cut-through and store and forward operating modes, as well as support for IEEE1588 PTP and Device-Level-Ring (DLR) protocols
Dual-channel 10/100 Ethernet (with dual-channel PHY included, Note 1)
High-speed, real-time port with dedicated DMAC
Many peripherals and GPIOs

Maxim’s PIXI

Maxim MAX11300 functional diagram

Maxim MAX11300 functional diagram

Engineers can mix and match 20 ADCs, 20 DACs or 20 High voltage digital I/O pins in any order using the MAX11300, mixed-signal PIXI technology.

PIXI claims to be the industry’s first configurable 20-channel, -10V to +10V high-voltage mixed-signal data converter.

It is for complex applications requiring multiple mixed-signal operations like base stations and industrial control and automation.

Graphical user interface software that comes with PIXI allows rapid drag and drop configuration of the device. Any function can be assigned to any pin.

Select an ADC and connect it to any of 20 pins, select a DAC and connect it to any pin or assign a digital I/O to any pin.

Unlike traditional multichannel data converters, PIXI lets engineers configure the 20 mixed signal input/outputs (I/Os) to optimise a design.

PIXI integrates a 12-bit, multichannel, analog-to-digital converter (ADC); a 12-bit, multichannel, buffered digital-to-analog converter (DAC); and high-voltage analog switches and digital I/Os.

With -10V to +10V, high-voltage range, PIXI enables high-voltage bipolar signals. It provides more design flexibility than any competing data converter.

Each of the 20 mixed-signal I/Os can be configured for the application, so designers can optimise PCB layout. Configuration software enables “drag and drop” setup of the 20 ports. Files can be exported for coding and easily reconfigured as requirements change.

Silego launches new CMIC

Silego SLG46120

Silego SLG46120 block diagram

Silego has launched a new Configurable Mixed-signal IC (CMIC) in the flagship GreenPAK (GPAK) family.

Silego’s GPAK family of NVM Programmable Mixed-signal Matrix devices enables many system functions such as system reset, power sequencing, voltage sensing, interface, and miscellaneous logic while minimizing component count, board space, and power consumption.

The SLG46120V maximizes the GPIO and functionality available in the incredibly small 1.6 x 1.6 x 0.55 mm 10-GPIO STQFN package. This device builds upon the 8-GPIO SLG46110V to expand the range of designs that can be addressed in such a small device.

SLG46120V projects use the GPAK development hardware and GPAK Designer.

“An upgrade path from the SLG46110V, the SLG46120V allows our customers to implement more complex and demanding functions,” says Silego’s Nathan John.s

Target Applications include:
• Consumer Electronics
o Wearables
o Portable: Tablets, Smartphones, Notebooks
o PCs and PC peripherals
• Commercial and Industrial Electronics
o Servers
o Embedded PCs
o Data Communications Equipment