SuperFlash is SST’s patented and proprietary NOR flash technology

Toshiba has developed a flash memory embedded process based on 65nm logic process that uses less power than current mainstream technology, and a single-poly non-volatile memory (NVM) process based on 130nm logic and analogue power process.

Applying the optimal process to diverse applications will allow Toshiba to expand its product line-up in such areas as microcontrollers, wireless communication ICs, motor controller drivers and power supply ICs, the company said.

Toshiba has adopted Silicon Storage Technology’s third-generation SuperFlash cell technology, in combination with its own 65nm logic process technology.

The company has also fine-tuned circuits and manufacturing processes in developing an ultra-low power consumption flash embedded logic process.

Following the first series of microcontrollers, Toshiba plans to release sample BLE (Bluetooth Low Energy) products, the short-range wireless technology, in fiscal year 2016.

The company also plans to apply the 65nm process to its wireless communication IC product family that can optimise use of low power consumption characteristics, including NFC (near field communication) controllers, and contactless cards.

In addition to low power consumption advantages, the process technology contributes to shorter development time, as application software can be easily written and rewritten to flash memory during development.

By engineering advances in devices offering ultra-low power consumption to promote further development of specialised flash peripheral circuit technology and of logic and analogue circuit technology, Toshiba will meet continuing growth in demand for low-power applications.

The company aims to lower power consumption for entire systems, targeting 50μA/MHz operation, and to develop innovative products for IoT.

In applications where significant cost reductions are a concern, Toshiba has developed an NVM embedded process that adopts Yield Microelectronics Corporation’s single-poly MTP (Multi-time programmable) cells on Toshiba’s 130nm logic process technology.

NVM and analogue circuits are embedded on a single chip that can incorporate multiple functions conventionally executed by a multi-chip system. This reduces the number of terminals and realises smaller packages.

Applying MTP specifications for write times improves the new process’s performance while limiting increased steps in mask pattern lithography to three or fewer, and even none. By using MTP to adjust output accuracy, Toshiba will expand its product line-up in fields where higher accuracy is essential, such as power management ICs.

Sample shipments of the 130nm-NVM and 65nm- flash are scheduled for the 4th quarter of 2015 and the 2nd quarter of 2016, respectively.

david manners

May semiconductor sales were 2% up on April snd 5% up on May 2014, reports the SIA. May sales were $28.2 billion. US sales were up 11.4% year-on-year.

“The global semiconductor industry overcame lingering macroeconomic uncertainty to post solid year-to-year growth in May,” says SIA CEO John Neuffer. “Year-to-year sales have now increased for 25 straight months, month-to-month sales increased for the first time in six months, and we expect modest growth to continue for the remainder of 2015 and beyond.”

Year-on-year sales increased in China (9.5% ) and Asia Pacific/All Other (8.0%), but decreased in Europe (-7.8%) and Japan (-11.8%). Compared to last month, sales were up in China (4.0%), Asia Pacific/All Other (3.3%), and the Americas (0.2%), but decreased slightly in Europe (-0.6% ) and held flat in Japan.

“Congress and the president recently gave the US semiconductor industry and other trade-dependent sectors a major boost by enacting Trade Promotion Authority (TPA), which makes it easier for the United States to strike deals on free trade agreements,” says Neuffer. “With TPA, the United States is more likely to get the Trans-Pacific Partnership (TPP) and other critical trade agreements across the finish line, leading to continued growth and innovation in our industry and across the U.S. economy.”

david manners

Source: Semico Research

Semiconductor industry capex will hit a record $68.7 billion this year – beating 2011’s previous record of $63.8 billion – and is up 9% on 2014, reports Semico Research.

Samsung has taken a big lead – $15 billion in capex this year ahead of TSMC’s $10.8 billion and Intel’s $8.7 billion.

After the Big Three come: GloFo on 4.7, Hynix 4, Sony and Toshiba 2, UMC 1.8, Inotera 1.6, SMIC and SanDisk 1.5, Qualcomm 0.7, Infineon 0.6 and ST 0.5.

The biggest increases in spend were at: GloFo by 22%, SMIC by 50% and Sony by 200%.

david manners

ISL9120 buck-boost switching regulator

Intersil Has launched the ISL9120 buck-boost switching regulator for power management of system power supplies and peripherals such as Wi-Fi, Bluetooth, memory cards or LCD modules.

Its adaptive current limit PFM architecture delivers efficiency up to 98%, says the company, with smooth transitions from buck-to-boost to prevent glitches in applications where light load efficiency and fast transient response are critical.

The device is small enough for IoT, wearables, smartphones, smart thermostats and point-of-sale devices that run on single-cell Li-ion or Li-polymer batteries, or 2-cell alkaline, NiCd or NiMH batteries.

Typical power solutions for wearables use three DC-DC regulators and 3-5 LDOs, which takes up valuable board space. LDOs also lack the high efficiency and reliability of a buck-boost regulator. For example, when LDOs are used to power peripherals in a system running on a Li-ion battery with the Vout near 3.3V, a large burst current from the applications processor can cause the Vin to droop below the LDO regulation voltage, causing a memory reset or application shutdown.

The ISL9120 buck-boost switching regulator eliminates this problem by addressing a wider Vin range and providing boost to avoid low voltage glitches that can cause a battery brownout when the Vin droops below the output voltage. Requiring only a single inductor and available in a small 1.41mm x 1.41mm package, designers no longer have to compromise efficiency or form factor.

According to Intersil the ISL9120 offers designers the flexibility to cover a variety of design needs by operating from a Vin of 1.8V to 5.5V and an adjustable output voltage from 1V to 5.2V. Its adaptive PFM operation with forced bypass mode and 2A switches support both low load and high load currents with high efficiency, ensuring longer battery life and less heat buildup.

The regulator also delivers 800mA current with 2.5V input and 3.3V output. During system stay alive conditions when regulation is not required, the ISL9120 goes into forced bypass mode, which reduces power consumption to a miniscule quiescent current of less than 0.5uA.

Key features and specifications are:

• Ultra high efficiency up to 98% reduces power drain and heat buildup
• Accepts a wide input voltage range from 1.8V to 5.5V, works with multiple battery topologies
• Large adjustable output voltage range from 1V to 5.2V for use with multiple power rails
• Output current up to 800mA (Vin = 2.5V, Vout = 3.3V)
• 2A switches supports both high and light load currents with high efficiency
• Ultra-small footprint with 1.41mm x 1.41mm package saves board space, requires only a single inductor
• Quiescent current of 41uA maximizes light load efficiency for low power consumption
• Automatic and selectable forced bypass power saving mode reduces quiescent current to less than 0.5uA
• Full protection for under-voltage, short-circuit and over-temperature

The ISL9120 is available in 9-bump WLCSP and QFN packages, and is priced at $0.72 in 1k quantities. Two ISL9120 evaluation boards allow designers to evaluate device features and performance: The ISL9120IIN-EVZ (3.3Vout) is priced at $74.45 and the ISL9120IIA-EVZ (adjustable Vout) is $73.35.

david manners

Rochester Electronics has been licensed by Freescale to manufacture the 68040 32bit microprocessor product family which Freescale will stop producing in |November.

Rochester has original Freescale packaged parts and silicon die from which it will manufacture a variety of device options. Freescale has also provided access to full design and test IP, making it possible for Rochester to continue manufacturing products even if all existing wafer stocks are exhausted.

In addition to the 68040 family, Rochester legacy support includes 68020, 68030, 68060 and the 68882 floating point coprocessor. Freescale will also be supporting Rochester on the supply of the MC68360 QUICC communications processor, which went EOL at the end of April.

“The MC680x0 family of products has been and will continue to be critical to many systems with long product life cycles,” says Rochestyer’s president Chris Gerrish, Rochester’s capability to continue production of a Freescale licensed and authorized solution will save customers immeasurable redesign costs, time and effort. Our in-house design, assembly and test operations allow for smooth continuous indefinite production and supply.”

# # #

david manners