Author Archives: david manners

ICs for secure quantum networks

Imec and the National University of Singapore (NUS)  (pictured) are to collaborate on developing chip-based prototypes for secure quantum communication networks. In this five-year agreement, Imec and NUS will jointly develop scalable, robust and efficient technologies for quantum key distribution and quantum random number generation, which are amongst the basic building blocks of a truly ...

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Card enables encoding acceleration of 8K video

Socionext  is enabling an encoding acceleration feature of 8K resolution video with the company’s ‘M820L’ media accelerator card. The ‘M820L’ is a media accelerator card that can be attached to a server system to accelerate codec processes without changing existing users’ server configuration. The card is the combination of a firmware update and an 8K ...

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Huawei offers its 5G technology to the US

Huawei  will offer its 5G technology to US companies in a bid to get its switchgear accepted in Western markets. Huawei’s founder and CEO Ren Zengfel (pictured) says he’ll sell patents, licences, production engineering know-how, code and designs to companies wanting to get into the 5G infrastructure business. Zengfel says he is “open to sharing ...

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Qualcomm and Ericsson make 3GPP 5G Release 15 connection

Qualcomm and Ericsson have completed a 5G New Radio (NR) data connection compliant with global 3GPP 5G NR Release 15 specifications in Standalone (SA) mode of operation. The connection was achieved on band n41 at Ericsson’s lab utilizing 5G commercial base stations from the Ericsson Radio System portfolio, its standalone NR software and its Cloud ...

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HCL to buy Sankalp Semi

HCL Technologies of Noida, India is to buy mixed signal IC design house Sankalp Semiconductor. Sankalp brings  capabilities in analogue, digital and mixed signal chip design for the Automotive, Consumer, IoT, Medical Electronics, Networking and Wireless markets Sankalp’s capabilities will help HCL sustain its position in the semiconductor space within the Engineering and R&D Services industry. ...

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SEMI billings down 20% y-o-y

Q2 chip manufacturing equipment billings reached $13.3 billion in the second quarter of 2019, down 20% y-o-y same and down 3% from Q1, reports SEMI. The data are gathered jointly with the Semiconductor Equipment Association of Japan (SEAJ) from more than 80 global equipment companies that provide data on a monthly basis. The quarterly billings ...

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Cost-effective dual channel and multi-standard TV demodulator

Socionext has brought out a digital TV dual channel demodulator, the SC1502AF-02. The SC1502AF-02 has been developed as a cost-effective dual channel and multi-standard model. It is a successor to the SC1501A, claimed to be the world’s first demodulator compatible with both ISDB-S3 and J.183, and now supports other standards including DVB-T and DVB-S to serve the ...

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Industrial network to accelerate slave equipment development

Renesas has developed the RX72M Industrial Network Solution to accelerate the development of industrial slave equipment using the RX72M Group of 32-bit industrial Ethernet microcontrollers (MCUs). The new RX72M solution includes an evaluation board, an operating system, middleware, and a sample software that supports approximately 70% of the communications protocols used in industrial network applications. This ...

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Phone morphs into video platform

The smartphone has eveolved from a voice-centric device to a media-centric platform, with more than 50% of owners now using their device to access video services on a monthly basis, according to IHS Markit. An average of 53% of internet users across six countries now utilize their smartphones for video services both in and out of ...

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Memory to take 43% of semi capex this year

Memory capex  will account for 43% of all semi industry capex this year compared to 49% last year, says IC Insights. Total semiconductor capex is forecast to slip 8% in 2019 to $97.8 billion following the record high spending level of $105.9 billion set in 2018. Capex spending for memory ICs was the driving factor ...

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