Qualcomm reported a calendar Q3 profit of $506 million on sales of $4.81 billion which were 17% down from $5.83 billion a year ago. The company expects calendar Q4 sales of between $4.4 billion and $5.2 billion. “We exit the fiscal year having successfully executed on our strategic priorities: helping to drive the commercialization of 5G ...
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Small Robot Company is offering a service for Weed Mapping, providing farmers with a per-plant view of their fields. Initially focused on broad leaved weeds (BLW), grass-type weeds such as blackgrass will follow later this growing season. Priced at £15 per hectare, the service will also map Emergent Wheat. SRC will also be releasing an ...
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Infineon is now targeting the next group of applications for SiC. It has produced an evaluation board to help to pave the way for SiC in motor drives. It was developed to support customers during their first steps in designing industrial drives applications with a maximum of 7.5 kW motor output. The evaluation board comprises ...
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STMicroelectronics has enhanced its STM32 LoRaWAN software expansion package for developers to support the latest Firmware Update Over The Air (FUOTA) specifications. FUOTA cost-effectively future-proofs LoRa devices by simplifying applying application-layer updates and RF-stack updates to devices in the field, increasing the value of LoRa as a long-range, low-power technology for connecting IoT devices. The LoRa Alliance ...
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GaN Systems and ON Semiconductor have joint availability of a high-speed, half-bridge GaN daughter board using GaN Systems’ 650 V, 30 A GaN E-HEMTs and ON Semiconductor’s NCP51820 high speed gate driver evaluation board. This is one of many upcoming GaN-based power system solutions both companies are developing. The kit t is developed for existing and ...
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Intel is sampling Stratix 10 FPGAs which have 10.2 million logic elements. The FPGA uses Intel’s Embedded Multi-die Interconnect Bridge (EMIB) technology. EMIB technology stitches two Stratix 10 GX FPGA core fabric die (with a capacity of 5.1 million logic elements per die) along with appropriate I/O tiles. The chip is targeted at the ASIC prototyping ...
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Earlier today, Arm’s owner SoftBank reported a $6.4 billion loss for Q3 as a result of re-valuations of its investments in its Vision Fund. The value of 25 Vision Fund companies was marked down. “There was a problem with my own judgment, that’s something I have to reflect on,” said Softbank CEO Masayoshi Son (pictured). The ...
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The share of semiconductor industry capex held by the top five companies’ (i.e., Samsung, Intel, TSMC, SK Hynix, and Micron) is forecast to reach an all-time high of 68% this year, surpassing the previous record high of 67% recorded in 2013 and 2018 (Figure 1), says IC Insights. With the top five spenders holding only ...
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GLOBALFOUNDRIES and SiFive are working to improve High Bandwidth Memory (HBM2E) performance on GLoFo’s 12LP+ FinFET process with 2.5D packaging. GloFo’s 12LP+ process has a 0.5Vmin SRAM bitcell for shuttling data between processors and memory, while a new interposer for 2.5D packages facilitates the integration of HBM with processors SiFive’s customisable HBM interface on GloFo’s 12LP platform and ...
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Cree has partnered with ZF Friedrichshafen, the automotive chassis and driveline specialist, to put SiC-based electric drivelines on the market in 2022. SiC-based inverters help increase drive efficiency and extend the range of EVs. The use of SiC-based power semiconductors will increase the range for electric vehicles compared to standard silicon technology. Due to high ...
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