THine, the Japanese serial interface and image signal processing specialist, has high-volume availability of its GPIO / LVCMOS transceiver IC, THCS251. The device allows engineers to aggregate up to 37 lines of different data rates into just 4 lines that can be received and transmitted in the same chip. With the THCS251, manufacturers can lower ...
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Designers that want to use Infinera InP open foundry services, part of the Infinera Optical Innovation Center, will benefit from a design workflow that starts from a graphical photonic IC design and system simulation environment. The workflow is enabled by VPItoolkit PDK Infinera— a pluggable toolkit extension to VPI Photonic Circuits – which adds by support of the PDK building blocks for ...
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Intel and Macom are leading the GaN-on-Si patent landscape for RF electronics applications, according to Yole Developpement. Intel’s RF GaN-on-Si patent portfolio mainly relates to III-N transistors used in SoC , RF switches, ultra-short channel lengths, field plates, and III-N/Silicon monolithic IC, says Yole. Intel has adopted a global patenting strategy with 17 patents pending ...
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Researchers at Stanford University School of Engineering have developed a stretchy battery that could be useful for wearables. The battery can be stretched to twice its original length without any power loss. The polymers in lithium-ion batteries which conduct negative ions toward the battery’s positive pole are in the form of gels housed in a ...
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The Department for Digital, Culture, Media and Sport (DCMS) plans laws to ensure that all consumer smart devices sold in the UK adhere to the three security requirements: All consumer internet-connected device passwords must be unique and not resettable to any universal factory setting Manufacturers of consumer IoT devices must provide a public point of ...
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Imec announces that IEEE Std 1838TM-2019 – recently approved by the IEEE Standards Association – will be included in IEEE Xplore Digital Library from February 2020 onward. The new standard allows die makers to design dies which, if compliant to this standard, constitute, once stacked in a 3D-IC by a stack integrator, a consistent stack-level ...
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November SEMI billings were up 17.5% y-o-y at $2.49 billion. The November 2019 l figure was $2.12 billion. The November 2019 figure is 17.8% higher than the December 2018 billings level of $2.11 billion. “Monthly billings of North American equipment manufacturers reached a level not seen since June 2018,“ says SEMI CEO Ajit Manocha, “the ...
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ST and simulation software specialist Fieldscale are developing touch-enabled user interfaces for smart devices containing ST’s STM32 microcontrollers (MCUs). ST and Fieldscale now enable STM32 customers to take a faster and more efficient route to market by introducing support for ST’s Arm Cortex-based 32-bit MCUs to Fieldscale’s SENSE development platform. Fieldscale SENSE delivers the design, ...
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Intel intends to return to a 2 to 2.5 year process cadence. “We want to get back to a two to two-and-a-half year cadence,” says CEO Bob Swan (pictured), “and shortly after launching 10, our expectations is we will have our first 7 nanometer product launch in the latter part about 2021 with CPUs to ...
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The Met has decided to deploy face recognition technology. “This is an important development for the Met and one which is vital in assisting us in bearing down on violence,” says assistant commissioner Nick Ephgrave (pictured), “as a modern police force, I believe that we have a duty to use new technologies to keep people ...
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