Revenue per wafer is on the increase at TSMC as processes move to 7nm and 5nm, says IC Insights, but are declining at other leading foundries. The success and proliferation of ICs has largely hinged on the ability of IC manufacturers to continue offering more performance and functionality for the money. Driving down the cost of ...
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Kioxia’s CM6 and CD6 Series PCIe 4.0 NVMe enterprise SSDs are now shipping. The CM6 and CD6 include in-band NVMe-MI, persistent event log, namespace granularity, and shared stream writes. Both drives are SFF-TA-1001 conformant (also known as U.3), which allows them to be used in tri-mode enabled backplanes, which can accept SAS, SATA or NVMe SSDs. ...
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Leti has created an IC that demonstrates the possibility of integrating conventional electronic devices and elements with quantum dots on a CMOS chip. The chip, fabricated on 28nm FD-SOI process, integrates analogue and digital functions (multiplexer, buffer, signal amplifier, oscillator, level converter) that represent future instrumentation needs for the quantum accelerator envisioned in ...
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Intel is reported to be in talks to sell its home connectivity unit to MaxLinear. In November, Bloomberg reported that Intel had appointed a financial adviser to help with a sale of the unit. Intel CEO had said he was looking for solutions for units in areas where Intel is not competitive. Last month, Intel ...
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4Q19 DRAM revenue decreased 1.5% QoQ and contract prices began an uptrend in 1Q20, says DRAMeXchange. After three quarters if adjustment, DRAM inventory returned to normal levels for most OEMs in 4Q19. As the growth in DRAM supply will be limited in 2020, buyers have been raising procurement ahead of time and DRAM suppliers increased ...
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OmniVision is sampling its first 64MP image sensor featuring a 0.8 micron pixel size to enable high resolution smartphone cameras in a 1/1.7″ optical format. Built on OmniVision’s PureCel Plus stacked die technology, this sensor provides leading edge still image capture and exceptional 4K video performance with electronic image stabilization (EIS) for high end smartphones. The OV64C ...
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Apple’s law-suit against its former chief CPU architect Gerard Williams (pictured) could decide whether Silicon Valley’s 63 year-old tradition of spin-offs will be killed. Apple is saying that Williams was in breach of his contract with Apple by planning to start a competitive business during his employment with Apple and recruiting other Apple employees in company ...
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3D sensors are moving from just the front to include the rear of phones while diversifying their applications, says Yole Developpement. Rear sensors will be in 42% of mobile phones by 2025, reckons Yole, serving multiplying use cases. First used for photography, to enhance bokeh and zoom capabilities, they will expand into AR and gaming. ...
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Filtronic has launched mmWave transceiver modules for E-band (71 – 76GHz and 81 – 86 GHz) applications in carrier grade mobile backhaul which it calls Morpheus II. Morpheus II is based on Filtronic’s E-band transceiver platform, of which over 36,000 units have already been shipped and deployed worldwide. Each Morpheus II transceiver module contains all ...
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The world’s top-five wafer capacity leaders each had capacity of more than 1,000,000 wafer starts per month at the end of 2019 with the combined capacity of the top five companies representing 53% of total global wafer capacity, says IC Insights in its Global Wafer Capacity 2020-2024 report. In contrast, the top five capacity leaders in ...
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