Author Archives: david manners

Phase-change and MRAM winning market adoption

3D XPoint and STT-MRAM will lead a $6 billion market for emerging memory technologies in 2025, says Yole Developpement. “The stand-alone emerging NVM market will grow to over $4 billion in 2025”, says Yole’s  Simone Bertolazzi,  “it will be driven by two key segments: low-latency storage (enterprise and client drives) and persistent memory (NVDIMMs).” The ...

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Automated vision design for FPGA and ASIC

MathWorks has announced that, with the recent availability of Release 2019b of the MATLAB and Simulink product families, Vision HDL Toolbox includes native multipixel streaming support to process high-frame-rate (HFR) and high-resolution videos on FPGAs. Video, image processing, and FPGA design engineers can speed the exploration and simulation of behavior and implementation tradeoffs when processing ...

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Samsung in mass production of LPDDR5 DRAM

Samsung has begun mass producing 16GB LPDDR5 mobile DRAM package for smartphones. Data transfer rate for the 16GB LPDDR5 comes in at 5,500 megabits per second (Mb/s), approximately 1.3 times faster than the previous mobile memory (LPDDR4X, 4266Mb/s). Compared to an 8GB LPDDR4X package, the new mobile DRAM delivers more than 20-percent energy savings while ...

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Embedded World: Dialog adds to IO-Link family

Dialog has added a new member to its IO-Link product family – the CCE4503. The IC both expands the company’s reach into the IIoT market and connects the smallest and most price-sensitive IO-Link Device sensors and actuators.  The CCE4503 is the first IO-Link IC to be launched by Dialog following its acquisition of Creative Chips in ...

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Imec, ASML litho breakthrough enables 3nm process

Imec and ASML have made a breakthrough in litho by printing 24nm pitch lines, corresponding to the dimensions of critical BEOL metal layers of a 3nm  node process. By combining advanced imaging schemes, innovative resist materials and optimized settings on ASML’s NXE:3400B system in Imec’s cleanroom, the system is capable of printing lines/spaces at 24 ...

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Multi-connectivity module

Direct Insight, the Oxfordshire systems integrator and module vendor, has launched the TRITON-TX8M. The SODIMM-format SoM is based on NXP’s  i.MX8M Mini Quad ARM Cortex-A53 processor that features four 64-bit ARM Cortex-A53 cores running at up to 1.6GHz. The  68mm x 26mm (LVDS version: 28mm) TRITON module comes with 1024MB or 2048MB DDR3L and a ...

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Semi industry unaffected by coronavirus

The coronavirus has had little effect on the semiconductor industry says Omdia – a newly set up  tech analyst company formed by IHS Markit and Informa Tech. The semiconductor industry appears to have escaped the direct impact of the coronavirus crisis so far, but the market is likely to suffer the repercussions as the outbreak ...

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ISSCC2020: Energy harvesting ICs

Leti has made two energy harvesting chips: ·        Self-Tunable Phase-Shifted SECE Piezoelectric Energy Harvesting IC with a 30nW MPPT achieving 446% Energy-Bandwidth Improvement and 94% Efficiency. ·        Electromagnetic Mechanical Energy Harvester IC with no off-chip Component and One switching period MPPT achieving up to 95.9% end-to-end Efficiency and 460% Energy Extraction Gain.  In the first one, ...

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SI expects 7% semi growth

Bill Jewell’s Semiconductor Intelligence expects to see 7% semiconductor market growth this year. For Q1, SI points out that, of  the eight top companies providing 1Q 2020 revenue guidance, six expect a revenue decline versus 4Q 2019, ranging from -3% from TI to -14.3% from ST. Qualcomm expects a 4.4% increase in revenue and Infineon ...

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