Africa needs to have a share in the semiconductor industry to secure its technological future, says a Huawei executive. Edison Xie, director of media affairs, Huawei Southern Africa region, told ITWeb that the semiconductor business offers Africa opportunities. “With a massive growth in technology hubs across the continent growing over 50% in the last several ...

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Researchers at Purdue University have found a way to turn waste polyethylene terephthalate into a battery anode. “We use an ultrafast microwave irradiation process to turn PET, or polyethylene terephthalate, flakes into disodium terephthalate, and use that as battery anode material,” said Vilas Pol, a Purdue associate professor of chemical engineering who has worked with the ...

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NXP and  Murata have combined to deliver RF front-end modules to Wi-Fi 6 standards. The NXP FEIC comes in a chip scale package (CSP) suitable for module integration and can support various 5G smartphones and portable computing devices. It enables 2×2 multiple input multiple output (MIMO) functionality. “Murata is very pleased to work with NXP ...

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Hackster.io, an Avnet community, is joining forces with the United Nations Development Programme (UNDP) and 12 leading technology companies to support the world’s developing countries in the wake of the coronavirus pandemic. Launching today, the COVID-19 Detect and Protect Challenge is calling on engineers to design low-cost and easily deployable software, hardware and services that ...

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Earlier today, Hynix reported Q1 revenue of $5.85 billion which was 6% up y-o-y. However its operating profit of $649 million was 41% down y-o-y. “There are a lot of uncertainties about the outlook for supply and prices for servers in the second half,” said Hynix CFO Cha Jin-seok. A slump in smartphone memory demand ...

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Within the framework of a new European H2020 project, nine research institutes and eight industrial partners across the whole value chain are collaborating on innovative solutions to produce silicon photovoltaic (PV) modules with higher performance, lower cost and better environmental profiles compared to commercially available modules. The HighLite project, coordinated by imec, a partner in ...

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IC unit shipments will register their first-ever back-to-back annual decline in 2020, says IC Insights From 2013 through 2018, IC unit shipments were on a respectable growth path with an 8% increase logged in 2013, a 9% jump registered in 2014, a 5% increase displayed in 2015, a 7% increase shown in 2016, a double-digit ...

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Yangtze Memory Technologies (YMTC) says that its 128-layer 1.33Tb QLC 3D NAND flash memory chip, Xtacking2-6070, has passed sample verification for SSD applications. It says it is co-working with multiple controller partners. YMTC has also  introduced a generic 128-layer 512Gb TLC (3 bit/cell) chip, X2-9060. In its 128-layer line of products, YMTC’s Xtacking has been ...

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