TSMC had November revenues up 34% y-o-y and down 12% m-o-m at US$8.52 billion. Revenue for January through November 2024 was up 31.8% y-o-y at US$85 billion.
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Equipment sales hit record $113bn, says SEMI
2024 sales of semiconductor manufacturing equipment will grow 6.5% y-o-y to reach $113 billion, says SEMI. Sales are forecast at $121 billion for 2025 and $139 billion for 2026. “Three ...
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AI having little effect on PC sales
The 2024 PC and tablet market will grow 3.8% to 403.5 million units in 2024, says IDC. Tablets are expected to grow 9.8% this year and PCs are expected to ...
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Nisshinbo SPDT switches in 1x1mm packages
Nisshinbo Micro Devices has launched the NT1821 and NT1822 High Isolation SPDT Switches are engineered to meet the demands of Wi-Fi 7 infrastructure and other wireless communication applications. The NT1821 ...
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Morris Chang on Intel, Gelsinger and Samsung
Intel “seems be looking for both a new strategy as well as a new CEO which is very hard,” said Morris Chang at the launch of his new book in ...
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UKAEA and Bristol University make first carbon-14 diamond battery
Scientists and engineers from the UK Atomic Energy Authority (UKAEA) and the University of Bristol have created the world’s first carbon-14 diamond battery. This new type of battery has the ...
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October semi sales up 22.1% y-o-y
October semiconductor sales were up 22.1% y-o-y and 2.8% m-o-m at $56.9 billion compared to the $46.6 billion of October 2023, says the SIA. Additionally , a new WSTS industry ...
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Farnell end-of-year sale
Farnell Global has announced end-of-year offers on a range of Test & Tools (T&T) products across the EMEA. The year-end sale is designed to offer significant discounts on an extensive ...
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Q3 foundry revenues up 27% y-o-y
Foundry revenue grew 27% YoY and 11% QoQ in Q3 2024, according to Counterpoint Research’s Foundry Quarterly Tracker. The growth was primarily driven by strong AI demand and a faster-than-expected ...
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Broadcom SiP enables development of custom accelerators
Broadcom is shipping its 3.5D eXtreme Dimension System in Package (XDSiPTM) platform technology which enables consumer AI customers to develop custom accelerators (XPUs). The 3.5D XDSiP integrates more than 6000 ...
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