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Cable assemblies keep a low profile under cooling hardware

May 6, 2025
Caroline Hayes

Exhibiting a low mated height of 4.35mm, the Si-Fly LP (low profile) cable-to-board assemblies have been released by Samtec for use in data centre, HPC and AI applications. Typically in ...

The post Cable assemblies keep a low profile under cooling hardware appeared first on Electronics Weekly.

PCIM: Five automotive uses for a 1,700V flyback dc-dc converter

May 6, 2025
steve bush

At PCIM in Nuremberg today, Power Integrations revealed five 800V automotive power supply reference designs for its 1,700V InnoSwitch3-AQ flyback dc-dc converter IC: RDK-994Q – 35W 40 to 1kVdc input, ...

The post PCIM: Five automotive uses for a 1,700V flyback dc-dc converter appeared first on Electronics Weekly.

PCIM: 1,000V 125A MEMS relay proof-of-concept

May 6, 2025
steve bush

Menlo Microsystems is demonstrating a way to scale its MEMS relays – micro electromechanical relays – to “power distribution and control systems to 10MW and beyond” today at PICM in ...

The post PCIM: 1,000V 125A MEMS relay proof-of-concept appeared first on Electronics Weekly.

Spain to put €808m into quantum technologies

May 6, 2025
david manners

Spain is to invest €808 million in quantum technologies relating to computing, communications and sensors. The two main sources of funding are. ERDF funds and the Recovery, Transformation and Resilience ...

The post Spain to put €808m into quantum technologies appeared first on Electronics Weekly.

Redwire boosts PIL-BOX in-space drug development technology

May 6, 2025
Alun Williams

Redwire is expanding its in-space drug development programme as it launches a new version of its PIL-BOX technology for a cancer-detection experiment. To complement the existing PIL-BOX platform, the Florida-based ...

The post Redwire boosts PIL-BOX in-space drug development technology appeared first on Electronics Weekly.

Infineon launches CoolSiC MOSFET 750 G2 technology

May 6, 2025
david manners

Infineon has launched its CoolSiC MOSFET 750 V G2 technology, designed to deliver improved system efficiency and increased power density in automotive and industrial power conversion applications. The technology offers ...

The post Infineon launches CoolSiC MOSFET 750 G2 technology appeared first on Electronics Weekly.

Current sensor integrated into power module

May 6, 2025
david manners

Asahi Kasei Microdevices  (AKM) and Silicon Austria Labs GmbH (SAL) have completed a joint proof of concept for integrating a current sensor into a power module to be used in ...

The post Current sensor integrated into power module appeared first on Electronics Weekly.

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