TSMC’s first production of panel-level-packaging will use a 310x310mm substrate rather than the 510x515mm substrate initially trialled. It was decided, a source told the Nikkei, that production “should start from ...
The post TSMC opts for smaller substrate for initial PLP runs appeared first on Electronics Weekly.
The 45th Symposium on VLSI Technology & Circuits will be held in Kyoto, Japan on June 8-12, 2025 at the Rihga Royal Hotel. The theme of the event is: “Cultivating ...
The post Symposium on VLSI Technology & Circuits in Kyoto, appeared first on Electronics Weekly.
In Q1 Apple fell from first place to fifth place in the China smartphone market, In Q4 2024, Apple had a slim lead as No.1 but, in Q1 2025, Apple’s ...
The post Apple loses share in China smartphone market appeared first on Electronics Weekly.
Addressing the growing use of AI and high-performance computing, JEDEC has published a new high-bandwidth memory (HBM) DRAM standard: HBM4. It aims to improve the performance, efficiency, and scalability of ...
The post JEDEC HBM4 high-bandwidth memory standard addresses next-gen AI, HPC appeared first on Electronics Weekly.
