TSMC is discussing a jv to take over Intel Foundry with Nvidia, Broadcom, Qualcomm and AMD, according to Reuters. Under the plan, TSMC would take a stake of not more ...
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Crypto Quantique is demonstrating the QuarkLink Hybrid PQC security platform at Embedded World 2025 on booth 5-171. The company is also showing its latest analogue and digital silicon IP offerings ...
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The power module packaging materials market will reach almost $6.1 billion by 2030 with a CAGR of almost 11% between 2024 and 2030, says Yole Group. Packaging materials costs accounted ...
The post Power module packaging materials market has 11% CAGR 2024-30 appeared first on Electronics Weekly.
Taoglas, the antenna and IoT specialist, is expanding its TFM series of multi-band GNSS front-end modules. TFM modules comprise a two-stage cascaded filter and low noise amplifier (LNA) topology encapsulated ...
The post Embedded World: Taoglas adds to multi-band GNSS front-end modules appeared first on Electronics Weekly.
The European Space Agency (ESA) LightShip initiative is studying the possibilities for a propulsive tug, or “interplanetary transfer service”. Additionally, four consortia will define what a small, low-cost Mars satellite-platform ...
The post ESA plots spacecraft passenger mission for LightShip tug appeared first on Electronics Weekly.
Renesas is aiming at the high-volume vision AI market with a 15Top/s 10Top/s/W microcontroller. Called RZ/V2N, it comes with the company’s own AI accelerator, DRP-AI3. The 15Top/s (INT8) claim comes ...
The post Embedded World: 15Top/s 10Top/s/W MCU for AI inferencing appeared first on Electronics Weekly.
At Embedded World today, Samtec announced mid-board optical transceivers for embedded and rugged applications, including phased array radar and medical imaging. ‘Mid-board’ describes optical links that replace PCB tracks for very high ...
The post Embedded World: On board 56Gbit/s optical links appeared first on Electronics Weekly.
Onsemi has released 1.2Mpixel time-of-flight (iToF) matrix sensors for 3D imaging fast-moving objects. “By using proprietary global shutter pixel architecture and on-board storage, the Hyperlux ID family can capture an ...
The post Embedded World: Area time-of-flight sensor scans the world in 3D appeared first on Electronics Weekly.
Cambridge GaN Devices has patented a technique for lowering losses in 100kW+ IGBT-based vehicle traction drives, at lower cost than all-silicon-carbide inverters, it said. It involves connecting GaN hemts in ...
The post APEC: small GaN transistors improve EV IGBT traction inverters appeared first on Electronics Weekly.
Infineon is now supporting Nvidia Tao AI models on its Psoc Edge microcontrollers, which combine Arm Cortex-M55 CPUs with Arm Ethos-U55 NPU. “The combination of these microcontrollers with Tao models ...
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