Teensy 4.0 and 4.1 Cortex-M7 development boards are to be manufactured by SparkFun Electronics. The boards are attractive because they offer a combining a powerful (600MHz dual-issue superscaler) processor processor ...
The post Arduino compatible Teesny Cortex-M7 dev boards now made by SparkFun appeared first on Electronics Weekly.
The UK Space Agency (UKSA) is boasting a record six-months for contract wins involving the European Space Agency (ESA). The agency highlights a significant increase for the funds in-flow involving ...
The post UKSA boasts record European Space Agency contract wins appeared first on Electronics Weekly.
Rapidus, which is due to produce its first prototype chips next month, has come under fire from politicians in Japan, reports the Nikkei. Rapidus needs $32 billion to get into ...
The post Rapidus wrestles with funding issues appeared first on Electronics Weekly.
SEEQC of New York has installed a Cross-Qubit Scaling Platform at the National Quantum Computing Centre (NQCC) in Oxfordshire. SEEQC uses digital ICs to deliver quantum computing. On NQCC’s Harwell ...
The post Classical-Quantum computing platform installed at Harwell appeared first on Electronics Weekly.
Synaptics has extended its Veros Triple Combo connectivity portfolio with the SYN461x family of ultra-low-power (ULP) Wi-Fi 2.4/5/6 GHz, Bluetooth 6.0 and Bluetooth Low Energy (BLE), and IEEE 802.15.4 (Zigbee/Thread ...
The post Synaptics extends Veros appeared first on Electronics Weekly.
Siemens Digital Industries Software announced has expanded the cloud platforms of choice available for systems-of-systems development with its PAVE360 technology for Software Defined Vehicle (SDV) development which is now available ...
The post PAVE360 SDV tech available on AMD CPUs and GPUs on Azure appeared first on Electronics Weekly.
JEDEC and OCP (Open Compute Project Foundation) announce new Chiplet Design Kits for EDA use covering four areas: Assembly, Substrate, Material and Test. Basically, they are a way for chiplet ...
The post JEDEC, OCP design kits progress automated SiP design using chiplets appeared first on Electronics Weekly.
