Foundry revenue grew 27% YoY and 11% QoQ in Q3 2024, according to Counterpoint Research’s Foundry Quarterly Tracker. The growth was primarily driven by strong AI demand and a faster-than-expected ...
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Broadcom is shipping its 3.5D eXtreme Dimension System in Package (XDSiPTM) platform technology which enables consumer AI customers to develop  custom accelerators (XPUs). The 3.5D XDSiP integrates more than 6000 ...
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Nexperia has brought out a portfolio of logic ICs in tiny automotive-qualified MicroPak XSON5 leadless packaging. MicroPak XSON5 is a thermally enhanced plastic enclosure with a 75% smaller PCB footprint ...
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BBN Technologies, of the RTX Group, is working to deliver a prototype photonic chip that uses exotic quantum states of “squeezed light”. It is part of DARPA’s INSPIRED (Intensity Squeezed ...
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