EMS provider Escatec has integrated a UV light feature to its die bonder, significantly enhancing the precision and efficiency of the micro-assembly processes. The company has built a customised UV-curing ...
The post Escatec adds UV to die bonder to enhance assembly precision appeared first on Electronics Weekly.
OroraTech has successfully closed its €25 million Series B funding round to boost its predictive AI capabilities and orbital sensor network. The Munich-based company, which describes itself as world leader ...
The post OroraTech raises €25m Series B for wildfire detection from space appeared first on Electronics Weekly.
Qorvo’s QPF0219 is a multi-chip Front-End Module (FEM) designed for 2-18 GHz Wide-Band radar applications. The FEM integrates a T/R switch, a limiter, a low-noise amplifier and a power amplifier. ...
The post FEM for 2-18GHz Wide-Band radar appeared first on Electronics Weekly.
Software Radio Systems (SRS) has integrated and tested nine O-RAN Radio Units (O-RUs) from leading vendors Benetel, Foxconn, Picocom, Liteon, VVDN and AMD with its srsRAN Enterprise 5G software solution. ...
The post SRS validates nine O-RUs for O-RAN networks appeared first on Electronics Weekly.
