VC funding of AI startups fell from $29.6 billion in Q2 to $11.8 billion in Q3, says Stocklytics.com. The total number of deals dropped by 28% y-o-y to 79 in ...
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PhotonDelta launches competition for PIC applications
Dutch photonic chip industry accelerator PhotonDelta is launching an engineering contest in collaboration with Wevolver to come up with applications for photonic chips that tackle global challenges. The competition invites ...
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WES Student and Apprentice Conference 2024 running in Bristol
The Women’s Engineering Society’s conference for students and apprentices – the WES Student and Apprentice Conference 2024 – will be taking place in Bristol this year. It takes place on ...
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New Adhesives, Dispensing Equipment Improve Bonding Efficiency
Adhesive suppliers tackle a range of new bonding applications.
Prize for UL94V-0 certified flame retardant bio-plastic
Hull UK based Floreon has won the US Plastics Industry Association’s ‘innovation in bioplastics’ award for its plant-based, flame retardant, halogen-free polymer. Called Therma-Tech is a PLA (polylactic acid) with ...
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Industry unites to drive photonic chip applications
PhotonDelta, the European hub for photonics, will launch a worldwide competition for new applications for photonics chips at PIC Summit 2024 (Eindhoven 15 October). Partners include imec, LioniX International, Smart ...
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TSMC Q3 revenue up 36% y-o-y
TSMC had revenue in the July-September period of $23.62 billion – up 36% on the $17.3 billion of Q3 2023. September sales of $7.74 billion were up 39.6% y-o-y. TSMC ...
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1 inch 200W buck boost delivers 9.6 to 28Vdc
TDK-Lambda has introduced 200W non-isolated dc-dc converters in the 1 x 1inch PCB-mount industry package. In each case, the output can be adjusted across 9.6 – 28V and can be ...
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Mediatek’s flagship phone processor
Mediatek has adopted Arm’s top-end Cortex-X925 CPU in its second-generation ‘all big core’ phone processor – Dimensity 9400, made by TSMC on a 3nm process. The X925 runs at up ...
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Eliyan chiplet interconnect fabbed on 3nm process
Eliyan, the chiplet interconnect specialist, has got first silicon of its NuLink-2.0 PHY, manufactured on a 3nm process. The device achieves 64Gbps/bump, claimed to be the industry’s highest performance for ...
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