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New Adhesives, Dispensing Equipment Improve Bonding Efficiency

October 9, 2024
John Sprovieri

Adhesive suppliers tackle a range of new bonding applications.

Prize for UL94V-0 certified flame retardant bio-plastic

October 9, 2024
steve bush

Hull UK based Floreon has won the US Plastics Industry Association’s ‘innovation in bioplastics’ award for its plant-based, flame retardant, halogen-free polymer. Called Therma-Tech is a PLA (polylactic acid) with ...

The post Prize for UL94V-0 certified flame retardant bio-plastic appeared first on Electronics Weekly.

Industry unites to drive photonic chip applications

October 9, 2024
Caroline Hayes

PhotonDelta, the European hub for photonics, will launch a worldwide competition for new applications for photonics chips at PIC Summit 2024 (Eindhoven 15 October). Partners include imec, LioniX International, Smart ...

The post Industry unites to drive photonic chip applications appeared first on Electronics Weekly.

TSMC Q3 revenue up 36% y-o-y

October 9, 2024
david manners

TSMC had revenue in the July-September period of $23.62 billion – up 36% on the $17.3 billion of Q3 2023. September sales of $7.74 billion were up 39.6% y-o-y. TSMC ...

The post TSMC Q3 revenue up 36% y-o-y appeared first on Electronics Weekly.

1 inch 200W buck boost delivers 9.6 to 28Vdc

October 9, 2024
steve bush

TDK-Lambda has introduced 200W non-isolated dc-dc converters in the 1 x 1inch PCB-mount industry package. In each case, the output can be adjusted across 9.6 – 28V and can be ...

The post 1 inch 200W buck boost delivers 9.6 to 28Vdc appeared first on Electronics Weekly.

Mediatek’s flagship phone processor

October 9, 2024
steve bush

Mediatek has adopted Arm’s top-end Cortex-X925 CPU in its second-generation ‘all big core’ phone processor – Dimensity 9400, made by TSMC on a 3nm process. The X925 runs at up ...

The post Mediatek’s flagship phone processor appeared first on Electronics Weekly.

Eliyan chiplet interconnect fabbed on 3nm process

October 9, 2024
david manners

Eliyan, the chiplet interconnect specialist, has got first silicon of its NuLink-2.0 PHY, manufactured on a 3nm process. The device achieves 64Gbps/bump, claimed to be the industry’s highest performance for ...

The post Eliyan chiplet interconnect fabbed on 3nm process appeared first on Electronics Weekly.

Q-CTRL adds $59m to its $113m Series B

October 9, 2024
david manners

Q-CTRL, the Australian quantum infrastructure software specialist, has expanded its Series B Funding Round to $113 million with $59 million of new capital. The Series B-2 all-equity funding round was ...

The post Q-CTRL adds $59m to its $113m Series B appeared first on Electronics Weekly.

70th IEDM

October 9, 2024
david manners

The 70th IEEE International Electron Devices Meeting (IEDM) takes place December 7-11, 2024 at  the Hilton San Francisco Union Square Hotel, with online access to recorded content available afterward. The ...

The post 70th IEDM appeared first on Electronics Weekly.

Accelerated server spend pushes Q2 data centre capex up 46%

October 9, 2024
david manners

Spending on accelerated servers for data centres grew 46%  in 2Q, says Dell’Oro, while a recovery in the general-purpose Server and Storage System markets appears to be underway, with most ...

The post Accelerated server spend pushes Q2 data centre capex up 46% appeared first on Electronics Weekly.

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